![Intel Joule" 570x Developer Kit, motherboard](https://cdn.multitronic.fi/images/prod/0/9/GT.PDKW-1.jpg "Intel Joule" 570x Developer Kit, motherboard")
![Intel Joule" 570x Developer Kit, motherboard](https://cdn.multitronic.fi/images/prod/0/9/GT.PDKW-2.jpg "Intel Joule" 570x Developer Kit, motherboard")
![Intel Joule" 570x Developer Kit, motherboard](https://cdn.multitronic.fi/images/prod/0/9/GT.PDKW-3.jpg "Intel Joule" 570x Developer Kit, motherboard")
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| Processor | |
| Processor frequency | 1700 MHz |
| Processor model | T5700 |
| Processor lithography | 14 nm |
| Processor family | Intel Atom |
| Processor socket | 2 - 100 pin Hirose |
| 64-bit computing |  |
| Processor cores | 4 |
| Processor boost frequency | 2.4 GHz |
| Memory | |
| Internal memory type | LPDDR4 |
| Flash memory | 16384 MB |
| Maximum internal memory | 4 GB |
| ECC |  |
| Memory bandwidth (max) | 25.6 GB/s |
| Memory channels | Quad |
| Internal storage capacity | 16 GB |
| Removable memory card slot | uSD |
| Pre-installed memory | |
| Ports & interfaces | |
| Wi-Fi standards | IEEE 802.11ac |
| Bluetooth version | 4.1 |
| Ethernet LAN | |
| Bluetooth | |
| Wi-Fi | |
| HDMI ports quantity | 1 |
| HDMI version | 1.4b |
| Frequency range | 2.5 - 5 GHz |
| USB version | 2.0/3.0 (3.1 Gen 1) |
| USB ports quantity | 2 |
| UART | |
| MIPI DSI 1.1 | |
| MPI CSI interface | |
| MPI DSI interface | |
| I2C interface | |
| GPIO interface | |
| MIMO | |
| Weight & dimensions | |
| Weight | 25 g |
| Package weight | 171 g |
| Package depth | 149 mm |
| Package height | 46 mm |
| Package width | 87 mm |
| Package type | Box |
| Board dimensions | 24 x 48 mm |
| Operating system/software | |
| Operating system installed | Linux Kernel 4.4 optimized for IOT |
| Windows operating systems supported | Windows 10 IOT Core |
| Linux operating systems supported | Ubuntu 16.04,Ubuntu Core |
| Expansion slots | |
| PCI Express slots version | 2.0 |
| PCI Express configurations | 1x1 |
| PCI Express x1 (Gen 2.x) slots | 1 |
| PCI Express interface data lanes | x1 |
| Maximum number of PCI Express lanes | 1 |
| PCI Support | Yes |
| Design | |
| Product family | Intel® Joule™ Products |
| Product series | Intel® Joule™ Kits |
| Graphics | |
| On-board graphics card model | |
| On-board graphics card | |
| Number of displays supported | 2 |
| Features | |
| Form factor | System on Module |
| Trusted Platform Module (TPM) | |
| DC input voltage | 3.6-5.25 V |
| Intel Fast Memory Access | |
| Intel Flex Memory Access | |
| Intel® AES New Instructions (Intel® AES-NI) | |
| Intel I/O Acceleration Technology | |
| Intel AC'97 technology | |
| Intel Client Initiated Remote Access (CIRA) technology | |
| Embedded options available | |
| Intel Remote Wake technology | |
| Intel Remote PC Assist Technology (RPAT) | |
| Intel Quiet System Technology (QST) | |
| Intel Quick Resume Technology | |
| Intel Rapid Storage Technology | |
| Intel Rapid Storage Technology enterprise | |
| Intel Virtualization Technology for Directed I/O (VT-d) | |
| Intel Clear Video Technology | |
| ARK ID | 96414 |
| Board type | Compute module |
| EAN | 735858322294 |
| Warranty | 3 years |
| Source: Icecat.biz | |
Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
Embedded Storage indicates the presence and size of onboard storage capacity that is built into the board, in addition to any drives that could be added via other interfaces.
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
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