CPU THERMAL PASTE COMPOUND

Technical details
Evaporation (@ 200°C/24h)	0.001%
Bleed (@ 200°C/24h)	0.005%
Weight & dimensions
Weight	24 g
Height	18 mm
Width	72 mm
Depth	18 mm
Packaging data
Package weight	37 g
Package depth	152 mm
Package height	23 mm
Package width	84 mm
Features
Operating relative humidity (H-H)	10 - 80%
Storage temperature (T-T)	-50 - 100 °C
Operating temperature (T-T)	-20 - 100 °C
Product colour	White
Thermal resistance	0.195 °C/W
Thermal conductivity	1.066 W/m·K
EAN	0065030844826
Warranty	1 year
Source: Icecat.biz

The HEATGREASE20 CPU Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan to work more efficiently to remove harmful heat from the CPU.

This 20g tube of ceramic-based thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required.

Please see our support section for the Material Safety Data Sheet for HEATGREASE20.

The StarTech.com Advantage
- Improves the heat transfer between a CPU and heatsink to keep the CPU running cooler
- Effectively fills surface imperfections on CPU to prevent air pockets and help heat transfer
- Ceramic-based compound that is electrically non-conductive, for safe use around electronics

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