logo Multitronic Oy
Korsholmanpuistikko 38
65100 Vaasa
Web: www.multitronic.fi
Telephone: 06 - 319 77 00
E-mail: info@multitronic.fi
CPU.P-DUO.G6951.2.8G/3M/1066.K
259,90 €
incl. 24% VAT
Currently not available
Multitronic warehouse0
Multitronic - JNT Vaasa0
Multitronic - JNT Pietarsaari0
iTronic Vaasa0
iTronic Seinäjoki0
Multitronic / iTronic Lappeenranta0
Multitronic / iTronic Jyväskylä0
Multitronic Mariehamn0
Supplier0
Estimated delivery timeNot confirmed
from 3,90 €
Fetch from the shop0,00 €
Posti Parcel Point3,90 €
Postal Parcel5,60 €
Parcel to the Doorstep11,10 €
Home Delivered Parcel11,70 €
Matkahuolto Near Parcel6,20 €
Matkahuolto Bus Parcel4,10 €
ACER
KC.95101.DEG
3 months
More info about this product
Specifications
Processor
Processor modelG6951
Processor lithography32 nm
Processor familyIntel Pentium G
Box
Processor socketLGA 1156 (Socket H)
SteppingK0
Processor cores2
L3 cache speed2.8 GHz
System bus rate2.5 GT/s
Processor threads2
Compatible chipsetsIntel H55 Express, Intel H57 Express, Intel P55 Express, Intel Q57 Express
Processor operating modes64-bit
Component forPC
Processor cache3 MB
Bus typeDMI
Processor frequency2.8 GHz
Processor cache typeL3
Memory
Maximum internal memory supported by processor16 GB
Memory types supported by processorDDR3-SDRAM
Memory clock speeds supported by processor1066 MHz
Memory bandwidth supported by processor (max)17 GB/s
Memory channels supported by processorDual
Energy management
VID Voltage Range0.6500 - 1.4000 V
Operational conditions
Tcase72.6 °C
Other features
Intel® Virtualization Technology (Intel® VT)VT-x
Graphics
On-board graphics adapter
On-board graphics adapter base frequency533 MHz
Number of displays supported (on-board graphics)2
Processor special features
Intel FDI Technology
Intel® Smart Cache
Enhanced Intel SpeedStep Technology
Intel VT-x with Extended Page Tables (EPT)
Intel Virtualization Technology (VT-x)
Features
Processor codeSLBTF
PCI Express slots version2.0
Execute Disable Bit
Idle States
CPU configuration (max)1
Number of Processing Die Transistors382 M
Processing Die size81 mm²
Number of Graphics & IMC Die Transistors177 M
Graphics & IMC lithography45 nm
Graphics & IMC Die Size114 mm²
PCI Express configurations1x16,2x8
Thermal Design Power (TDP)73 W
Maximum number of PCI Express lanes16
Processor package size37.5
EAN
Source: Icecat.biz
Read more...
Description

Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

VID Voltage Range
VID Voltage Range is an indicator of the minimum and maximum voltage values at which the processor is designed to operate. The processor communicates VID to the VRM (Voltage Regulator Module), which in turn delivers that correct voltage to the processor.

Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Read more...

No price development information for this product.