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Processor | |
Processor model | G860 |
Processor lithography | 32 nm |
Processor family | Intel Pentium |
Box | |
Processor socket | LGA 1155 |
Stepping | Q0 |
Processor cores | 2 |
Processor code | SR058 |
L3 cache speed | 3 GHz |
System bus rate | 5 GT/s |
Processor threads | 2 |
Compatible chipsets | Intel® B65 Express, Intel® B75 Express, Intel® H61 Express, Intel® H67 Express, Intel® H77 Express, Intel® P67 Express, Intel® Q65 Express, Intel® Q67 Express, Intel Q75 Express, Intel® Q77 Express, Intel® Z68 Express, Intel® Z75 Express, Intel® Z77 Express |
Processor operating modes | 64-bit |
Component for | PC |
Processor cache | 3 MB |
Bus type | DMI |
Processor frequency | 3 GHz |
Processor cache type | L3 |
Memory bandwidth supported by processor (max) | 21 GB/s |
Memory | |
ECC | |
Memory channels | Dual-channel |
Maximum internal memory supported by processor | 32 GB |
Memory types supported by processor | DDR3-SDRAM |
Memory clock speeds supported by processor | 1066,1333 MHz |
Weight & dimensions | |
Processor package size | 37.5 mm |
Energy management | |
Thermal Design Power (TDP) | 65 W |
Operational conditions | |
Tcase | 69.1 °C |
Other features | |
Intel® Virtualization Technology (Intel® VT) | VT-x |
Graphics | |
On-board graphics card model | |
On-board graphics card | |
On-board graphics adapter base frequency | 850 MHz |
On-board graphics adapter dynamic frequency (max) | 1100 MHz |
Number of displays supported (on-board graphics) | 2 |
Processor special features | |
Intel FDI Technology | |
Intel Fast Memory Access | |
Intel Flex Memory Access | |
Intel® Smart Cache | |
Enhanced Intel SpeedStep Technology | |
Intel VT-x with Extended Page Tables (EPT) | |
Intel Virtualization Technology (VT-x) | |
Features | |
Supported instruction sets | SSE4.1,SSE4.2 |
PCI Express slots version | 2.0 |
Execute Disable Bit | |
Idle States | |
Thermal Monitoring Technologies | |
CPU configuration (max) | 1 |
Graphics & IMC lithography | 32 nm |
EAN | |
Warranty | 3 months |
Source: Icecat.biz |
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Instruction Set Extensions
Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
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