No price development information for this product.
|Processor front side bus||1066 MHz|
|Processor lithography||45 nm|
|Processor family||Intel Core 2 Duo|
|L2 cache speed||2.26|
|Compatible chipsets||Intel GM45 Express, Intel PM45 Express|
|Processor operating modes||64-bit|
|Processor cache||3 MB|
|Processor frequency||2.26 GHz|
|Processor cache type||L2|
|Intel® Virtualization Technology (Intel® VT)||VT-x|
|Processor special features|
|Enhanced Intel SpeedStep Technology|
|Intel Virtualization Technology (VT-x)|
|Execute Disable Bit|
|Thermal Monitoring Technologies|
|Number of Processing Die Transistors||410 M|
|Processing Die size||107 mm²|
|Graphics & IMC lithography||45 nm|
|Thermal Design Power (TDP)||25 W|
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.