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CPU.DUO-P7570/2.26G/1066/R0

Manufacturer: ACER
ID: KC.75701.DPP
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Processor
Processor modelP7570
Processor front side bus1066 MHz
Processor lithography45 nm
Processor familyIntel® Core™2 Duo
Boxcross
Processor socket478
SteppingR0
Processor cores2
Processor codeSLGLW
L2 cache speed2.26 GHz
Compatible chipsetsIntel® GM45 Express, Intel® PM45 Express
Processor operating modes64-bit
Component forNotebook
Processor cache3 MB
Processor frequency2.26 GHz
Processor cache typeL2
Energy management
Thermal Design Power (TDP)25 W
Operational conditions
Tjunction105 °C
Other features
Intel® Virtualization Technology (Intel® VT)VT-x
Processor special features
Enhanced Intel SpeedStep Technologycheckmark
Intel Virtualization Technology (VT-x)checkmark
Features
Execute Disable Bitcheckmark
Idle Statescheckmark
Thermal Monitoring Technologiescheckmark
Number of Processing Die Transistors410 M
Processing Die size107 mm²
Graphics & IMC lithography45 nm
EAN
Warranty3 months
Source: Icecat.biz

Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

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