CPU.CI3-3220.3.3G/3M/1600/55W

Processor
Processor model	i3-3220
Processor lithography	22 nm
Processor family	Intel Core i3
Box
Processor socket	LGA 1155
Stepping	L1
Processor cores	2
Processor code	SR0RG
L3 cache speed	3.3 GHz
System bus rate	5 GT/s
Processor threads	4
Compatible chipsets	Intel® B75 Express, Intel® H61 Express, Intel® H77 Express, Intel Q75 Express, Intel® Q77 Express, Intel® Z75 Express, Intel® Z77 Express
Processor operating modes	64-bit
Component for	PC
Processor cache	3 MB
Bus type	DMI
Thermal Design Power (TDP)	55 W
Processor cache type	L3
Memory bandwidth supported by processor (max)	25.6 GB/s
Memory
ECC
Memory channels	Dual-channel
Maximum internal memory supported by processor	32 GB
Memory types supported by processor	DDR3-SDRAM
Memory clock speeds supported by processor	1333,1600 MHz
Weight & dimensions
Processor package size	37.5 mm
Operational conditions
Tcase	65.3 °C
Other features
Intel® Virtualization Technology (Intel® VT)	VT-x
Graphics
On-board graphics card model	Intel® HD Graphics 2500
On-board graphics card
On-board graphics card base frequency	650 MHz
On-board graphics card dynamic frequency (max)	1050 MHz
Number of displays supported (on-board graphics)	3
Processor special features
Intel® My WiFi Technology (Intel® MWT)
Intel® Identity Protection Technology (Intel® IPT)
Intel® Anti-Theft Technology (Intel® AT)
Intel® Hyper Threading Technology (Intel® HT Technology)
Intel® Quick Sync Video Technology
Intel® InTru™ 3D Technology
Intel® Wireless Display (Intel® WiDi)
Intel FDI Technology
Intel® Clear Video HD Technology (Intel® CVT HD)
Intel® Insider™
Intel® Smart Cache
Enhanced Intel SpeedStep Technology
Intel VT-x with Extended Page Tables (EPT)
Intel Virtualization Technology (VT-x)
Conflict-Free processor
Features
Supported instruction sets	AVX, SSE4.1,SSE4.2
PCI Express slots version	2.0
Execute Disable Bit
Thermal Monitoring Technologies
CPU configuration (max)	1
Embedded options available
Graphics & IMC lithography	22 nm
PCI Express configurations	1x16,2x8,1x8+2x4
Thermal solution specification	PCG 2011C
Market segment	Desktop
EAN
Warranty	3 months

Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Instruction Set Extensions
Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

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