Estimated delivery time: Not confirmed
|Processor lithography||32 nm|
|Processor family||Intel® Xeon® 5000 Sequence|
|Processor socket||LGA 1366|
|CPU multiplier (bus/core ratio)||19|
|L3 cache speed||2.53 GHz|
|System bus rate||5.86 GT/s|
|Processor operating modes||64-bit|
|Processor boost frequency||2.8 GHz|
|Processor cache||12 MB|
|Processor frequency||2.53 GHz|
|Processor cache type||L3|
|Maximum internal memory supported by processor||288 GB|
|Memory types supported by processor||DDR3-SDRAM|
|Memory clock speeds supported by processor||800,1066 MHz|
|Memory bandwidth supported by processor (max)||25.6 GB/s|
|Memory channels supported by processor||Triple|
|ECC supported by processor|
|Weight & dimensions|
|Processor package size||42.5|
|VID Voltage Range||0.750 - 1.350 V|
|Thermal Design Power (TDP)||80 W|
|Intel® Virtualization Technology (Intel® VT)||VT-d,VT-x|
|On-board graphics adapter|
|Processor special features|
|Intel® Hyper Threading Technology (Intel® HT Technology)|
|Intel® Turbo Boost Technology|
|Intel® AES New Instructions (Intel® AES-NI)|
|Enhanced Intel SpeedStep Technology|
|Intel Trusted Execution Technology|
|Intel VT-x with Extended Page Tables (EPT)|
|Intel Demand Based Switching|
|Intel Virtualization Technology for Directed I/O (VT-d)|
|Intel Virtualization Technology (VT-x)|
|Execute Disable Bit|
|Physical Address Extension (PAE)|
|CPU configuration (max)||2|
Performance. Efficiency. Agility.
Intel’s newest dual-core processor for dual processor (DP) servers and workstations delivers a new level of energy-efficient performance from the innovative Intel® Core™ microarchitecture, optimized for low-power, dual-core, 64-bit computing.
Significant performance headroom, especially for multi-threaded applications, helps boost system utilization through virtualization and application responsiveness.
Intel® Core™ microarchitecture
Better performance on multiple application types and user environments at a substantially reduce power envelope.
Majority of SKUs at 65W
Significantly lower power (compared to previous generation) helps improve data center density and power/thermal operating costs.
Ultra-dense, ultra low-power SKUs at 40W
Low-voltage SKU available at reduced power envelopes will deliver even higher performance per watt — helps reduce power/thermal operating costs and improve data center density.
4 MB shared L2 cache
Increases efficiency of L2 cache-to-processor data transfers, maximizing main memory to processor bandwidth and reducing latency.
Entire L2 cache can be allocated to one core.
1066 and 1333 MHz system bus
Faster system bus speeds than previous generations for increased throughput.
Intel® Virtualization Technology
New processor hardware enhancements that support software-based virtualization, enabling migration of more environments — including 64-bit OSs and applications — to virtual environments.
Intel® Extended Memory 64 Technology (Intel® EM64T)
Flexibility for 64-bit and 32-bit applications and operating systems.
Enhanced Intel® Speedstep™ Technology
Helps reduce average system power consumption and potentially improves system acoustics.
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