Estimated delivery time: Not confirmed
|Processor front side bus||1333 MHz|
|Processor lithography||45 nm|
|Processor family||Intel® Xeon® 5000 Sequence|
|Processor socket||LGA 771|
|L2 cache speed||3|
|Compatible chipsets||Intel® 5000P, Intel® 5000V, Intel® 5000X, Intel® 5100, Intel® 5400|
|Processor operating modes||64-bit|
|Processor cache||12 MB|
|Processor frequency||3 GHz|
|Processor cache type||L2|
|Weight & dimensions|
|Processor package size||37.5|
|VID Voltage Range||0.850 - 1.3500 V|
|Thermal Design Power (TDP)||120 W|
|Intel® Virtualization Technology (Intel® VT)||VT-x|
|Processor special features|
|Enhanced Intel SpeedStep Technology|
|Intel Demand Based Switching|
|Intel Virtualization Technology (VT-x)|
|Execute Disable Bit|
|Thermal Monitoring Technologies|
|Number of Processing Die Transistors||820 M|
|Processing Die size||214 mm²|
|Graphics & IMC lithography||45 nm|
Performance. Efficiency. Agility.
Intel’s newest dual-core processor for dual processor (DP) servers and workstations delivers a new level of energy-efficient performance from the innovative Intel Core microarchitecture, optimized for low-power, dual-core, 64-bit computing.
The Dual-Core Intel Xeon processor 5100 series is ideal for intense computing environments, 32-bit and 64-bit business-critical applications and high-end workstations. Combined with the Intel 5000 chipset family and Fully Buffered DIMM (FBDIMM) technology, the new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 3 times the performance and 3.5 times the performance/watt of previous-generation single-core Intel Xeon processors. The new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 2.25 times the performance and 2.35 times the performance/watt of previous-generation dual-core Intel Xeon processors.
The Dual-Core Intel Xeon processor 5100 series is compatible with Intel 5000P, 5000V and 5000X series of chipsets. Server boards based on these chipsets are optimized for dual core with advanced platform features of Dual Independent Bus and Fully Buffered DIMM memory technology offering up to 4X and 3X available bandwidth of current generation platforms. Improved I/O performance is possible with PCI Express and the option of Intel I/O Acceleration Technology.
Significant performance headroom, especially for multi-threaded applications, helps boost system utilization through virtualization and application responsiveness.
Intel Core microarchitecture
Better performance on multiple application types and user environments at a substantially reduce power envelope.
Majority of SKUs at 65W
Significantly lower power (compared to previous generation) helps improve data center density and power/thermal operating costs.
Ultra-dense, ultra low-power SKUs at 40W
Low-voltage SKU available at reduced power envelopes will deliver even higher performance per watt — helps reduce power/thermal operating costs and improve data center density.
4 MB shared L2 cache
Increases efficiency of L2 cache-to-processor data transfers, maximizing main memory to processor bandwidth and reducing latency.
Entire L2 cache can be allocated to one core.
1066 and 1333 MHz system bus
Faster system bus speeds than previous generations for increased throughput.
Intel Virtualization Technology
New processor hardware enhancements that support software-based virtualization, enabling migration of more environments — including 64-bit OSs and applications — to virtual environments.
Intel Extended Memory 64 Technology (Intel EM64T)
Flexibility for 64-bit and 32-bit applications and operating systems.
Enhanced Intel Speedstep Technology
Helps reduce average system power consumption and potentially improves system acoustics.
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