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Processor | |
Processor model | X5570 |
Processor lithography | 45 nm |
Processor family | Intel Xeon |
Box | |
Processor socket | LGA 1366 |
Stepping | D0 |
Processor cores | 4 |
Processor code | SLBF3 |
L3 cache speed | 2.93 GHz |
System bus rate | 6.4 GT/s |
Processor threads | 8 |
Compatible chipsets | Intel® 5500, Intel® 5520 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.333 GHz |
Component for | Server/Workstation |
Processor cache | 8 MB |
Bus type | QPI |
Number of QPI links | 2 |
Processor frequency | 2.93 GHz |
Processor cache type | L3 |
Memory bandwidth supported by processor (max) | 32 GB/s |
Memory | |
ECC | |
Memory channels | Triple |
Maximum internal memory supported by processor | 144 GB |
Memory types supported by processor | DDR3-SDRAM |
Memory clock speeds supported by processor | 800,1066,1333 MHz |
Weight & dimensions | |
Processor package size | 42.5 mm |
Energy management | |
VID Voltage Range | 0.75 - 1.35 V |
Thermal Design Power (TDP) | 95 W |
Operational conditions | |
Tcase | 75 °C |
Other features | |
Intel® Virtualization Technology (Intel® VT) | VT-d,VT-x |
Processor special features | |
Intel® Hyper Threading Technology (Intel® HT Technology) | |
Intel® Turbo Boost Technology | |
Intel® Smart Cache | |
Enhanced Intel SpeedStep Technology | |
Intel VT-x with Extended Page Tables (EPT) | |
Intel Demand Based Switching | |
Intel Virtualization Technology for Directed I/O (VT-d) | |
Intel Virtualization Technology (VT-x) | |
Features | |
Execute Disable Bit | |
Idle States | |
CPU configuration (max) | 2 |
Number of Processing Die Transistors | 731 M |
Processing Die size | 263 mm² |
Graphics & IMC lithography | 45 nm |
EAN | |
Warranty | 3 months |
Source: Icecat.biz |
System Bus
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
VID Voltage Range
VID Voltage Range is an indicator of the minimum and maximum voltage values at which the processor is designed to operate. The processor communicates VID to the VRM (Voltage Regulator Module), which in turn delivers that correct voltage to the processor.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
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