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CPU.XEON.X5570.2.93G/8M/1333

Manufacturer: ACER
ID: KC.55701.EPX
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Specifications
Description
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Processor
Processor modelX5570
Processor lithography45 nm
Processor familyIntel Xeon
Boxcross
Processor socketLGA 1366
SteppingD0
Processor cores4
Processor codeSLBF3
L3 cache speed2.93 GHz
System bus rate6.4 GT/s
Processor threads8
Compatible chipsetsIntel® 5500, Intel® 5520
Processor operating modes64-bit
Processor boost frequency3.333 GHz
Component forServer/Workstation
Processor cache8 MB
Bus typeQPI
Number of QPI links2
Processor frequency2.93 GHz
Processor cache typeL3
Memory bandwidth supported by processor (max)32 GB/s
Memory
ECCcheckmark
Memory channelsTriple
Maximum internal memory supported by processor144 GB
Memory types supported by processorDDR3-SDRAM
Memory clock speeds supported by processor800,1066,1333 MHz
Weight & dimensions
Processor package size42.5 mm
Energy management
VID Voltage Range0.75 - 1.35 V
Thermal Design Power (TDP)95 W
Operational conditions
Tcase75 °C
Other features
Intel® Virtualization Technology (Intel® VT)VT-d,VT-x
Processor special features
Intel® Hyper Threading Technology (Intel® HT Technology)checkmark
Intel® Turbo Boost Technologycheckmark
Intel® Smart Cachecheckmark
Enhanced Intel SpeedStep Technologycheckmark
Intel VT-x with Extended Page Tables (EPT)checkmark
Intel Demand Based Switchingcheckmark
Intel Virtualization Technology for Directed I/O (VT-d)checkmark
Intel Virtualization Technology (VT-x)checkmark
Features
Execute Disable Bitcheckmark
Idle Statescheckmark
CPU configuration (max)2
Number of Processing Die Transistors731 M
Processing Die size263 mm²
Graphics & IMC lithography45 nm
EAN
Warranty3 months
Source: Icecat.biz

System Bus
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.

Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

VID Voltage Range
VID Voltage Range is an indicator of the minimum and maximum voltage values at which the processor is designed to operate. The processor communicates VID to the VRM (Voltage Regulator Module), which in turn delivers that correct voltage to the processor.

Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

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