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CPU.CEL-1000M/1.8G/1600/35W

KC.10001.CMP
176,90 €
Show price: incl. VAT excl. VAT
Online store:
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Estimated delivery time: Not confirmed
Shipment cost: from 3,90 €
Fetch from the shop0,00 €
Posti Parcel Point3,90 €
Postal Parcel5,60 €
Parcel to the Doorstep11,10 €
Home Delivered Parcel11,70 €
Matkahuolto Near Parcel6,20 €
Matkahuolto Bus Parcel4,10 €
Stores:select
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Specifications
Processor
Processor model1000M
Processor lithography22 nm
Processor familyIntel Celeron
Boxcross
Processor socketPGA988
SteppingP0
Processor cores2
Processor codeSR102
L3 cache speed1.8 GHz
System bus rate5 GT/s
Processor threads2
Compatible chipsetsIntel HM70 Express, Intel HM75 Express, Intel HM76 Express, Intel HM77 Express, Intel QM77 Express
Processor operating modes64-bit
Component forNotebook
Processor cache2 MB
Bus typeDMI
Processor frequency1.8 GHz
Processor cache typeL3
Memory
Maximum internal memory supported by processor32 GB
Memory types supported by processorDDR3L-SDRAM
Memory clock speeds supported by processor1333,1600 MHz
Memory bandwidth supported by processor (max)25.6 GB/s
Memory channels supported by processorDual
ECC supported by processorcross
Weight & dimensions
Processor package size37.5
Energy management
Thermal Design Power (TDP)35 W
Operational conditions
Tjunction105 °C
Other features
Intel® Virtualization Technology (Intel® VT)VT-x
Graphics
On-board graphics adapter modelIntel® HD Graphics
On-board graphics adaptercheckmark
On-board graphics adapter base frequency650 MHz
On-board graphics adapter dynamic frequency (max)1000 MHz
Number of displays supported (on-board graphics)3
Processor special features
Intel FDI Technologycheckmark
Intel Fast Memory Accesscheckmark
Intel Flex Memory Accesscheckmark
Intel® Smart Cachecheckmark
Enhanced Intel SpeedStep Technologycheckmark
Intel VT-x with Extended Page Tables (EPT)checkmark
Intel Virtualization Technology (VT-x)checkmark
Conflict Free processorcheckmark
Features
Supported instruction setsSSE4.1,SSE4.2
PCI Express slots version2.0
Execute Disable Bitcheckmark
Idle Statescheckmark
Thermal Monitoring Technologiescheckmark
CPU configuration (max)1
Graphics & IMC lithography22 nm
PCI Express configurations1x16,2x8,1x8+2x4
Maximum number of PCI Express lanes1
EAN
Warranty3 months
Description

Cache
CPU Cache is an area of fast memory located on the processor. Intel Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

System Bus
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.

Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

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