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|Processor lithography||22 nm|
|Processor family||Intel Celeron|
|L3 cache speed||1.8 GHz|
|System bus rate||5 GT/s|
|Compatible chipsets||Intel HM70 Express, Intel HM75 Express, Intel HM76 Express, Intel HM77 Express, Intel QM77 Express|
|Processor operating modes||64-bit|
|Processor cache||2 MB|
|Processor frequency||1.8 GHz|
|Processor cache type||L3|
|Maximum internal memory supported by processor||32 GB|
|Memory types supported by processor||DDR3L-SDRAM|
|Memory clock speeds supported by processor||1333,1600 MHz|
|Memory bandwidth supported by processor (max)||25.6 GB/s|
|Memory channels supported by processor||Dual|
|ECC supported by processor|
|Intel® Virtualization Technology (Intel® VT)||VT-x|
|On-board graphics adapter model||Intel® HD Graphics|
|On-board graphics adapter|
|On-board graphics adapter base frequency||650 MHz|
|On-board graphics adapter dynamic frequency (max)||1000 MHz|
|Number of displays supported (on-board graphics)||3|
|Processor special features|
|Intel FDI Technology|
|Intel Fast Memory Access|
|Intel Flex Memory Access|
|Intel® Smart Cache|
|Enhanced Intel SpeedStep Technology|
|Intel VT-x with Extended Page Tables (EPT)|
|Intel Virtualization Technology (VT-x)|
|Conflict Free processor|
|Supported instruction sets||SSE4.1,SSE4.2|
|PCI Express slots version||2.0|
|Execute Disable Bit|
|Thermal Monitoring Technologies|
|CPU configuration (max)||1|
|Graphics & IMC lithography||22 nm|
|PCI Express configurations||1x16,2x8,1x8+2x4|
|Thermal Design Power (TDP)||35 W|
|Maximum number of PCI Express lanes||1|
|Processor package size||37.5|
CPU Cache is an area of fast memory located on the processor. Intel Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.