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Processor | |
Processor model | 1000M |
Processor lithography | 22 nm |
Processor family | Intel Celeron |
Box | |
Processor socket | 478 |
Stepping | P0 |
Processor cores | 2 |
Processor code | SR102 |
L3 cache speed | 1.8 GHz |
System bus rate | 5 GT/s |
Processor threads | 2 |
Compatible chipsets | Intel® HM70 Express, Intel® HM75 Express, Intel HM76 Express, Intel HM77 Express, Intel® QM77 Express |
Processor operating modes | 64-bit |
Component for | Notebook |
Processor cache | 2 MB |
Bus type | DMI |
Thermal Design Power (TDP) | 35 W |
Processor cache type | L3 |
Memory bandwidth supported by processor (max) | 25.6 GB/s |
Memory | |
ECC | |
Memory channels | Dual-channel |
Maximum internal memory supported by processor | 32 GB |
Memory types supported by processor | DDR3L-SDRAM |
Memory clock speeds supported by processor | 1333,1600 MHz |
Weight & dimensions | |
Processor package size | 37.5 mm |
Operational conditions | |
Tjunction | 105 °C |
Other features | |
Intel® Virtualization Technology (Intel® VT) | VT-x |
Graphics | |
On-board graphics card model | |
On-board graphics card | |
On-board graphics card base frequency | 650 MHz |
On-board graphics card dynamic frequency (max) | 1000 MHz |
Number of displays supported (on-board graphics) | 3 |
Processor special features | |
Intel FDI Technology | |
Intel Fast Memory Access | |
Intel Flex Memory Access | |
Intel® Smart Cache | |
Enhanced Intel SpeedStep Technology | |
Intel VT-x with Extended Page Tables (EPT) | |
Intel Virtualization Technology (VT-x) | |
Conflict-Free processor | |
Features | |
Supported instruction sets | SSE4.1,SSE4.2 |
PCI Express slots version | 2.0 |
Execute Disable Bit | |
Idle States | |
Thermal Monitoring Technologies | |
CPU configuration (max) | 1 |
Graphics & IMC lithography | 22 nm |
PCI Express configurations | 1x16,2x8,1x8+2x4 |
Maximum number of PCI Express lanes | 1 |
Market segment | Mobile |
EAN | |
Warranty | 3 months |
Cache
CPU Cache is an area of fast memory located on the processor. Intel Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
System Bus
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
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Estimated delivery: Unknown
Today: 10:00 - 17:00
Estimated delivery: Unknown
Today: 10:00 - 18:00
Estimated delivery: Unknown
Today: 10:00 - 17:00
Estimated delivery: Unknown
Today: 10:00 - 18:00