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Intel Core i7 3520M mobiili - 2.9 GHz - 2 ydintä - 4 säiettä - 4 Mt cache - PGA988 Socket - OEM

AW8063801028703
380,90 €
Show price: incl. VAT excl. VAT
Online store:
Not confirmed

Estimated delivery time: Not confirmed
Shipment cost: from 3,90 €
Fetch from the shop0,00 €
Posti Parcel Point3,90 €
Postal Parcel5,60 €
Parcel to the Doorstep11,10 €
Home Delivered Parcel11,70 €
Matkahuolto Near Parcel6,20 €
Matkahuolto Bus Parcel4,10 €
Stores:select
Not confirmed
Specifications
Technical details
Product type4
Processor cache4096 KB
StatusLaunched
Product family3rd Generation Intel Core i7 Processors
Processor
Processor modeli7-3520M
Processor lithography22 nm
Processor familyIntel Core i7
Boxcross
Processor socketSocket G2
Processor cores2
CPU multiplier (bus/core ratio)29
Processor threads4
Processor operating modes64-bit
Processor boost frequency3.6 GHz
Component forPC
Processor cache4 MB
Bus typeDMI
Processor frequency2.9 GHz
Processor codenameIvy Bridge
Processor cache typeL3
Processor seriesIntel Core i7-3500 Mobile series
Processor ARK ID64893
Memory
Maximum internal memory supported by processor32 GB
Memory clock speeds supported by processor1333,1600 MHz
Memory bandwidth supported by processor (max)25.6 GB/s
Memory channels supported by processorDual
ECC supported by processorcross
Weight & dimensions
Processor package size37.5 x 37.5 (rPGA988B); 31.0 x 24.0 (BGA1023)
Energy management
Thermal Design Power (TDP)35 W
Operational conditions
Maximum operating temperature105 °C
Other features
Maximum internal memory32768 MB
Graphics
On-board graphics adapter modelIntel® HD Graphics 4000
On-board graphics adaptercheckmark
On-board graphics adapter base frequency650 MHz
On-board graphics adapter dynamic frequency (max)1250 MHz
On-board graphics adapter ID0x166
Number of displays supported (on-board graphics)3
Processor special features
Intel® My WiFi Technology (Intel® MWT)checkmark
Intel® Anti-Theft Technology (Intel® AT)checkmark
Intel® vPro™ Technologycheckmark
Intel® Hyper Threading Technology (Intel® HT Technology)checkmark
Intel® Turbo Boost Technology2.0
Y
Intel® Quick Sync Video Technologycheckmark
Intel® InTru™ 3D Technologycheckmark
Intel® Wireless Display (Intel® WiDi)checkmark
Intel FDI Technologycheckmark
Intel® Clear Video HD Technology (Intel® CVT HD)checkmark
Intel Dual Display Capable Technologycheckmark
Intel® Insider™checkmark
Intel Fast Memory Accesscheckmark
Intel Flex Memory Accesscheckmark
Intel® AES New Instructions (Intel® AES-NI)checkmark
Enhanced Intel SpeedStep Technologycheckmark
Intel Trusted Execution Technologycheckmark
Intel Enhanced Halt Statecheckmark
Intel VT-x with Extended Page Tables (EPT)checkmark
Intel Demand Based Switchingcross
Intel 64checkmark
Intel Virtualization Technology for Directed I/O (VT-d)checkmark
Conflict Free processorcheckmark
Features
Supported instruction setsAVX
PCI Express slots version3.0
Execute Disable Bitcheckmark
Thermal Monitoring Technologiescheckmark
CPU configuration (max)1
Embedded options availablecross
Graphics & IMC lithography22 nm
PCI Express configurations1x16,2x8
Maximum number of PCI Express lanes16
Market segmentMBL
EAN7330381146893
Description

Intel® Hyper-Threading Technology
Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Idle States
Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

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