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CPU.XEON.X5450.3.00GHz/12MB

Valmistaja: ACER
ID: KC.54501.DPX
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Tuotetiedot
Kuvaus
Myymäläsaatavuus
Toimitus
Hinnan muutokset
Prosessori
ProsessorimalliX5450
Suorittimen etupuolen väylä1333 MHz
Prosessorin litografia45 nm
SuoritinperheIntel Xeon
Laatikkocross
Prosessorin kantaLGA 771
Prosessorin ytimet4
L2-välimuistin nopeus3 GHz
Yhteensopivat piirisarjatIntel® 5000P, Intel® 5000V, Intel® 5000X, Intel® 5100, Intel® 5400
Prosessorin käyttötilat64-bittinen
Komponentti (tuotteelle)Palvelin/työasema
Prosessorin välimuisti12 MB
FSB-pariteetticheckmark
Prosessorin taajuus3 GHz
Prosessorin välimuistityyppiL2
Paino ja mitat
Prosessorin pakkauskoko37,5 mm
Virranhallinta
VID-jännitealue0,850 - 1,3500 V
Thermal Design Power (TDP)120 W
Ympäristöolosuhteet
Tcase62 °C
Muut ominaisuudet
Intel® Virtualization -teknologia (Intel® VT)VT-x
Suorittimen erityispiirteet
Enhanced Intel SpeedStep Technologycheckmark
Intel® Demand Based Switchingcheckmark
Intel® Virtualization Technology (VT-x)checkmark
Ominaisuudet
Execute Disable Bitcheckmark
Joutotilatcheckmark
Thermal Monitoring -teknologiacheckmark
Die transistorien prosessoinnin lukumäärä820 M
Die-koon prosessointi214 mm²
Grafiikka ja IMC-litografia45 nm
EAN4054318256129
Takuu3 kuukautta
Source: Icecat.biz

Performance. Efficiency. Agility.
Intel’s newest dual-core processor for dual processor (DP) servers and workstations delivers a new level of energy-efficient performance from the innovative Intel Core microarchitecture, optimized for low-power, dual-core, 64-bit computing.

The Dual-Core Intel Xeon processor 5100 series is ideal for intense computing environments, 32-bit and 64-bit business-critical applications and high-end workstations. Combined with the Intel 5000 chipset family and Fully Buffered DIMM (FBDIMM) technology, the new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 3 times the performance and 3.5 times the performance/watt of previous-generation single-core Intel Xeon processors. The new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 2.25 times the performance and 2.35 times the performance/watt of previous-generation dual-core Intel Xeon processors.

The Dual-Core Intel Xeon processor 5100 series is compatible with Intel 5000P, 5000V and 5000X series of chipsets. Server boards based on these chipsets are optimized for dual core with advanced platform features of Dual Independent Bus and Fully Buffered DIMM memory technology offering up to 4X and 3X available bandwidth of current generation platforms. Improved I/O performance is possible with PCI Express and the option of Intel I/O Acceleration Technology.

Dual-core processing
Significant performance headroom, especially for multi-threaded applications, helps boost system utilization through virtualization and application responsiveness.

Intel Core microarchitecture
Better performance on multiple application types and user environments at a substantially reduce power envelope.

Majority of SKUs at 65W
Significantly lower power (compared to previous generation) helps improve data center density and power/thermal operating costs.

Ultra-dense, ultra low-power SKUs at 40W
Low-voltage SKU available at reduced power envelopes will deliver even higher performance per watt — helps reduce power/thermal operating costs and improve data center density.

4 MB shared L2 cache
Increases efficiency of L2 cache-to-processor data transfers, maximizing main memory to processor bandwidth and reducing latency.
Entire L2 cache can be allocated to one core.

1066 and 1333 MHz system bus
Faster system bus speeds than previous generations for increased throughput.

Intel Virtualization Technology
New processor hardware enhancements that support software-based virtualization, enabling migration of more environments — including 64-bit OSs and applications — to virtual environments.

Intel Extended Memory 64 Technology (Intel EM64T)
Flexibility for 64-bit and 32-bit applications and operating systems.

Enhanced Intel Speedstep Technology
Helps reduce average system power consumption and potentially improves system acoustics.

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