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CPU.DUO-T5270.1.4GHz/2MB/800/M
573,90 €
inkl. 24% moms
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från 3,90 €
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Postens paketautomat3,90 €
Postpaket5,60 €
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ACER
KC.52701.DTP
3 månader
Mer info om denna produkt
Produktspecifikation
Processor
ProcessorT5270
Processor busshastighet800 MHz
Processorlitografi65 nm
ProcessorfamiljIntel Core 2 Duo
Låda
Processorsockel478
StegningM0
Processor antal kärnor2
L2-cache hastighet1.40
Processor driftlägen64-bitars
Komponent förBärbar dator
Processorns cache2 MB
Processorfrekvens1.4 GHz
Processorns cachetypL2
Strömtillförsel
VID Spänningsområde1,075 - 1,250 V
Miljökrav
T-junction100 °C
Processor specialfunktioner
Enhanced Intel Speedstep Technology
Egenskaper
Processor kodSLALK
Execute Disable Bit-säkerhet
Antal behandlingar Die Transistorer291 M
Bearbetning dö storlek143 mm²
Grafik & IMC litografi65 nm
Värmeavledningseffekt (TDP)35 W
Processorns förpackningsstorlek35
EAN
Source: Icecat.biz
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Beskrivning

Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

VID Voltage Range
VID Voltage Range is an indicator of the minimum and maximum voltage values at which the processor is designed to operate. The processor communicates VID to the VRM (Voltage Regulator Module), which in turn delivers that correct voltage to the processor.

Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

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