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CPU.XEON.X5570.2.93G/8M/1333

KC.55701.EPX
2454,90 €
Visa price: inkl. Moms exkl. Moms
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Avhämtning från butiken0,00 €
Postens paketautomat3,90 €
Postpaket5,60 €
Till dörren-paket11,10 €
Hempaket11,70 €
Matkahuolto Närpaket6,20 €
Matkahuolto Busspaket4,10 €
Produktspecifikation
Processor
ProcessorX5570
Processorlitografi45 nm
ProcessorfamiljIntel® Xeon® 5000 Sequence
Lådacross
ProcessorsockelLGA 1366
StegningD0
Processorkärnor4
L3-cache hastighet2,93 GHz
Systembuss6,4 GT/s
Processor antal trådar8
kompatibla chipsetIntel 5500, Intel 5520
Processor driftlägen64-bit
Processorboostfrekvens3,333 GHz
Komponent förServer/arbetsstation
Processorns cache8 MB
BusstypQPI
Antal QPI länkar2
Processorfrekvens2,93 GHz
Processorns cachetypL3
Minne
Högsta internminne som stöds av processorn144 GB
Minnestyper som stöds av processornDDR3-SDRAM
Minnesklockfrekvens som stöds av processorn800,1066,1333 MHz
Minnesbandbredd som stöds av processorn (max)32 GB/s
Minneskanaler som stöds av processornTredubbel
Processor med ECC-stödcheckmark
Strömtillförsel
VID Spänningsområde0,75 - 1,35 V
Miljökrav
TCASE75 ° C
Övriga egenskaper
Intel® Virtualization Technology (Intel® VT)VT-d,VT-x
Processor specialfunktioner
Intel® Hyper Threading Technology (Intel® HT Technology)checkmark
Intel® Turbo Boost Technologycheckmark
Intel® Smart Cachecheckmark
Enhanced Intel Speedstep Technologycheckmark
Intel® VT-x med utökad Sida Tabeller (EPT)checkmark
Intel® Efterfrågan Baserad Växlacheckmark
Intel® Virtualization Technology for Directed I/O (VT-d)checkmark
Intel Virtualization Technology (VT-x)checkmark
Egenskaper
Processor kodSLBF3
Execute Disable Bit-säkerhetcheckmark
Idle statercheckmark
CPU konfiguration (max)2
Antal behandlingar Die Transistorer731 M
Bearbetning dö storlek263 mm ²
Grafik & IMC litografi45 nm
Värmeavledningseffekt (TDP)95 W
Processorns förpackningsstorlek42.5
EAN
Source: Icecat.biz
Beskrivning

System Bus
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.

Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

VID Voltage Range
VID Voltage Range is an indicator of the minimum and maximum voltage values at which the processor is designed to operate. The processor communicates VID to the VRM (Voltage Regulator Module), which in turn delivers that correct voltage to the processor.

Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Prisutveckling

Ingen prisutvecklingsinformation för denna produkt.

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