Thermaltake DDR4 - 64 GB -3600 - CL - 18 - Dual Kit, RAM (black, R009R432GX2-3600C18A, TOUGHRAM RGB)
Tillverkare: THERMALTAKE
ID: R009R432GX2-3600C18A
46590€
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| Minne | |
| Internminne | 64 GB |
| Vikt & dimension | |
| Vikt | 79,8 g |
| Bredd | 1,8 mm |
| Egenskaper | |
| Typ av internminne | DDR4 |
| CAS-latens | 18 |
| Kompatibla produkter | Intel Z490, 300 Series, AMD X570, B550 |
| Minne klockhastighet | 3600 MHz |
| Färg på bakgrundsbelysning | Olika |
| Bakgrundsbelysning |  |
| Minnesspänning | 1.35 V |
| Komponent för | PC/server |
| Internminne | 64 GB |
| Minneslayout (moduler x storlek) | 2 x 32 GB |
| Intel Extreme Memory Profile (XMP) | |
| Intels minnesprofil Extreme Memory Profile (XMP) version | 2.0 |
| EAN | 4713227526715 |
Built with the highest quality of components to the highest of standards, the TOUGHRAM RGB delivers outstanding gaming performance with stunning RGB lighting maximized for effortless sync with your RGB ecosystem.
Tightly-Screened Hynix A-die ICs
The new Hynix A-die memory chips are thoroughly-screened and extended to 2GB capacity for each IC, providing optimal frequency and improved response time performance.
2oz Copper PCB
Specially optimized 10-layer PCB with 2oz copper inner layer provides enhanced electrical conduction to deliver uncompromised speed and reliability for maximum overclocking performance.
High Quality Gold Fingers
Use of 10μ gold fingers for enhanced durability and high wear resistance.
Aluminum Heat Spreader
Use of brushed aluminum heat spreader delivers exceptional heat dissipation to meet high-performance needs.
Extra Sturdy with a Fine Touch
Each RAM module weights up to 79.8g, with its heatsink accounting for 60.2g and a width spanning 1.8mm, this helps deliver outstanding heat dissipation and a solid touch.
Illuminate and Impress
10 super-bright addressable LEDs deliver 16.8M full spectrum RGB color with dynamic lighting effects to bring your gaming system to life.
Intel XMP 2.0 Ready
Overlock with ease and optimize system stability with a simple setting.
Tightly-Screened Hynix A-die ICs
The new Hynix A-die memory chips are thoroughly-screened and extended to 2GB capacity for each IC, providing optimal frequency and improved response time performance.
2oz Copper PCB
Specially optimized 10-layer PCB with 2oz copper inner layer provides enhanced electrical conduction to deliver uncompromised speed and reliability for maximum overclocking performance.
High Quality Gold Fingers
Use of 10μ gold fingers for enhanced durability and high wear resistance.
Aluminum Heat Spreader
Use of brushed aluminum heat spreader delivers exceptional heat dissipation to meet high-performance needs.
Extra Sturdy with a Fine Touch
Each RAM module weights up to 79.8g, with its heatsink accounting for 60.2g and a width spanning 1.8mm, this helps deliver outstanding heat dissipation and a solid touch.
Illuminate and Impress
10 super-bright addressable LEDs deliver 16.8M full spectrum RGB color with dynamic lighting effects to bring your gaming system to life.
Intel XMP 2.0 Ready
Overlock with ease and optimize system stability with a simple setting.
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