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Processor | |
Processor | 1000M |
Processorlitografi | 22 nm |
Processorfamilj | Intel Celeron |
Låda | |
Processorsockel | 478 |
Stegning | P0 |
Processorkärnor | 2 |
Processorkod | SR102 |
L3-cache hastighet | 1,8 GHz |
Systembuss, hastighet | 5 GT/s |
Processortrådar | 2 |
Kompatibla chipset | Intel® HM70 Express, Intel® HM75 Express, Intel® HM76 Express, Intel® HM77 Express, Intel® QM77 Express |
Processorns driftlägen | 64-bit |
Komponent för | Notebook |
Processorns cache | 2 MB |
Busstyp | DMI |
Värmeavledningseffekt (TDP) | 35 W |
Processorns cachetyp | L3 |
Minnesbandbredd som stöds av processorn (max) | 25,6 GB/s |
Minne | |
ECC | |
Minneskanaler | Dubbla kanaler |
Högsta internminne som stöds av processorn | 32 GB |
Minnestyper som stöds av processorn | DDR3L-SDRAM |
Minnesklockfrekvens som stöds av processorn | 1333,1600 MHz |
Vikt & dimension | |
Processorns förpackningsstorlek | 37,5 mm |
Miljökrav | |
T-junction | 105 ° C |
Övriga egenskaper | |
Intel® Virtualization Technology (Intel® VT) | VT-x |
Grafiken | |
Ombord grafikkort modell | |
Ombord grafikkort | |
Basfrekvens för inbyggt grafikkort | 650 MHz |
Högsta dynamiska frekvens för inbyggt grafikkort | 1000 MHz |
Antal skärmar som stöds (inbyggt grafikkort) | 3 |
Processor specialfunktioner | |
Intel® FDI-teknik | |
Intel® Snabb Memory Access | |
Intel® Flex minnesåtkomst | |
Intel® Smart Cache | |
Förstärkt Intel Speedstep Technology | |
Intel® VT-x med utökad Sida Tabeller (EPT) | |
Intel Virtualization Technology (VT-x) | |
Etisk processor (Conflict Free) | |
Egenskaper | |
Stödda instruktionsset | SSE4.1,SSE4.2 |
PCI Express-kortplatser version | 2.0 |
Execute Disable Bit-säkerhet | |
Idle stater | |
Termiska övervakningsteknik | |
CPU konfiguration (max) | 1 |
Grafik & IMC litografi | 22 nm |
PCI Express konfigurationer | 1x16,2x8,1x8+2x4 |
Högsta antal PCI Express-platser | 1 |
Marknadssegment | Mobil |
EAN | |
Garanti | 3 månader |
Cache
CPU Cache is an area of fast memory located on the processor. Intel Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
System Bus
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
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Beräknad leverans: Okänd
Idag: 10:00 - 18:00
Beräknad leverans: Okänd
Idag: 10:00 - 17:00
Beräknad leverans: Okänd
Idag: 10:00 - 18:00