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Processor | |
Processor model | G6950 |
Processor lithography | 32 nm |
Processor family | Intel Pentium |
Box | |
Processor socket | LGA 1156 |
Processor cores | 2 |
VID Voltage Range | 0.6500 - 1.4000 V |
L3 cache speed | 2.8 GHz |
System bus rate | 2.5 GT/s |
Processor threads | 2 |
Compatible chipsets | Intel® 3450, Intel® H55 Express, Intel® H57 Express, Intel® P55 Express, Intel® Q57 Express |
Processor operating modes | 64-bit |
Component for | PC |
Processor cache | 3 MB |
Bus type | DMI |
Thermal Design Power (TDP) | 73 W |
Processor cache type | L3 |
Memory bandwidth supported by processor (max) | 17 GB/s |
Memory | |
Memory channels | Dual-channel |
Maximum internal memory supported by processor | 16 GB |
Memory types supported by processor | DDR3-SDRAM |
Memory clock speeds supported by processor | 1066 MHz |
Weight & dimensions | |
Processor package size | 37.5 mm |
Operational conditions | |
Tcase | 72.6 °C |
Other features | |
Intel® Virtualization Technology (Intel® VT) | VT-x |
Graphics | |
On-board graphics card | |
On-board graphics card base frequency | 553 MHz |
Number of displays supported (on-board graphics) | 2 |
Processor special features | |
Intel FDI Technology | |
Intel® Smart Cache | |
Enhanced Intel SpeedStep Technology | |
Intel VT-x with Extended Page Tables (EPT) | |
Intel Virtualization Technology (VT-x) | |
Features | |
PCI Express slots version | 2.0 |
Execute Disable Bit | |
Idle States | |
CPU configuration (max) | 1 |
Number of Processing Die Transistors | 382 M |
Embedded options available | |
Processing Die size | 81 mm² |
Number of Graphics & IMC Die Transistors | 177 M |
Graphics & IMC lithography | 45 nm |
Graphics & IMC Die Size | 114 mm² |
PCI Express configurations | 1x16,2x8 |
Maximum number of PCI Express lanes | 16 |
Market segment | Desktop |
EAN | |
Warranty | 3 months |
Source: Icecat.biz |
The Intel Pentium processor with Intel dual-core technology delivers great desktop performance, low power enhancements, and multitasking for everyday computing.
Intel dual-core processing
Runs two independent processor cores in one physical package at the same frequency. Features up to 2 MB of shared L2 cache and 800 MHz Front Side Bus.
Intel Wide Dynamic Execution
Enables delivery of more instructions per clock cycle to improve execution time and energy efficiency.
Intel Smart Memory Access
Improves system performance by optimizing the use of the available data bandwidth.
Intel Advanced Smart Cache
The shared L2 cache is dynamically allocated to each processor core based on workload. This increases the probability that each core can access data from fast L2 cache, significantly reducing latency to frequently used data and improving performance.
Intel Advanced Digital Media Boost
Accelerates a broad range of multimedia, encryption, scientific and financial applications by significantly improving performance when executing Intel® Streaming SIMD Extension (SSE/SSE2/SSE3) instructions.
Intel 64 architecture
An enhancement to Intel’s 32-bit architecture to enable the processor to access larger amounts of memory.
Execute Disable Bit
Provides enhanced virus protection when deployed with a supported operating system.
Intel designed thermal solution for boxed processors
Intel boxed processors ship with a thermal solution specifically for this processor designed for maximum thermal and acoustic performance.
Estimated delivery: Unknown
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Estimated delivery: Unknown
Today: 10:00 - 18:00
Estimated delivery: Unknown
Today: 10:00 - 17:00
Estimated delivery: Unknown
Today: 10:00 - 18:00
Estimated delivery: Unknown
Today: 10:00 - 17:00
Estimated delivery: Unknown
Today: 10:00 - 18:00