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Processor | |
Processor model | L5630 |
Processor lithography | 32 nm |
Processor family | Intel Xeon |
Box | |
Processor socket | LGA 1366 |
Stepping | B1 |
Processor cores | 4 |
CPU multiplier (bus/core ratio) | 16 |
VID Voltage Range | 0.75 - 1.35 V |
L3 cache speed | 2.13 GHz |
System bus rate | 5.86 GT/s |
Processor threads | 8 |
Processor operating modes | 64-bit |
Processor boost frequency | 2.4 GHz |
Component for | Server/workstation |
Processor cache | 12 MB |
Bus type | QPI |
Number of QPI links | 2 |
Thermal Design Power (TDP) | 40 W |
Processor cache type | L3 |
Memory bandwidth supported by processor (max) | 25.6 GB/s |
Memory | |
ECC | |
Memory channels | Triple-channel |
Maximum internal memory supported by processor | 288 GB |
Memory types supported by processor | DDR3-SDRAM |
Memory clock speeds supported by processor | 800,1066 MHz |
Weight & dimensions | |
Processor package size | 42.5 mm |
Operational conditions | |
Tcase | 63.1 °C |
Other features | |
Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
Graphics | |
On-board graphics card | |
Processor special features | |
Intel® Turbo Boost Technology | |
Intel® AES New Instructions (Intel® AES-NI) | |
Enhanced Intel SpeedStep Technology | |
Intel Trusted Execution Technology | |
Intel VT-x with Extended Page Tables (EPT) | |
Intel Demand Based Switching | |
Intel Virtualization Technology for Directed I/O (VT-d) | |
Intel Virtualization Technology (VT-x) | |
Features | |
Supported instruction sets | SSE4.2 |
Execute Disable Bit | |
Idle States | |
Market segment | Server |
EAN | 4054318256280 |
Warranty | 3 months |
Source: Icecat.biz |
Performance. Efficiency. Agility.
Intel’s newest dual-core processor for dual processor (DP) servers and workstations delivers a new level of energy-efficient performance from the innovative Intel® Core™ microarchitecture, optimized for low-power, dual-core, 64-bit computing.
Dual-core processing
Significant performance headroom, especially for multi-threaded applications, helps boost system utilization through virtualization and application responsiveness.
Intel® Core™ microarchitecture
Better performance on multiple application types and user environments at a substantially reduce power envelope.
Majority of SKUs at 65W
Significantly lower power (compared to previous generation) helps improve data center density and power/thermal operating costs.
Ultra-dense, ultra low-power SKUs at 40W
Low-voltage SKU available at reduced power envelopes will deliver even higher performance per watt — helps reduce power/thermal operating costs and improve data center density.
4 MB shared L2 cache
Increases efficiency of L2 cache-to-processor data transfers, maximizing main memory to processor bandwidth and reducing latency.
Entire L2 cache can be allocated to one core.
1066 and 1333 MHz system bus
Faster system bus speeds than previous generations for increased throughput.
Intel® Virtualization Technology
New processor hardware enhancements that support software-based virtualization, enabling migration of more environments — including 64-bit OSs and applications — to virtual environments.
Intel® Extended Memory 64 Technology (Intel® EM64T)
Flexibility for 64-bit and 32-bit applications and operating systems.
Enhanced Intel® Speedstep™ Technology
Helps reduce average system power consumption and potentially improves system acoustics.
Estimated delivery: Unknown
Today: 10:00 - 18:00
Estimated delivery: Unknown
Today: 09:00 - 17:00
Estimated delivery: Unknown
Today: 10:00 - 18:00
Estimated delivery: Unknown
Today: 10:00 - 17:00
Estimated delivery: Unknown
Today: 10:00 - 18:00
Estimated delivery: Unknown
Today: 10:00 - 17:00
Estimated delivery: Unknown
Today: 10:00 - 18:00