logo Multitronic Oy
Korsholmanpuistikko 38
65100 Vaasa
Web: www.multitronic.fi
Telephone: 06 - 319 77 00
E-mail: info@multitronic.fi
CPU.DUAL.CORE.G2030.3.0G.3M.13
110,90 €
incl. 24% VAT
Currently not available
Multitronic warehouse0
Multitronic - JNT Vaasa0
Multitronic - JNT Pietarsaari0
iTronic Vaasa0
iTronic Seinäjoki0
Multitronic / iTronic Lappeenranta0
Multitronic / iTronic Jyväskylä0
Multitronic Mariehamn0
Supplier0
Estimated delivery timeNot confirmed
from 3,90 €
Fetch from the shop0,00 €
Posti Parcel Point3,90 €
Postal Parcel5,60 €
Parcel to the Doorstep11,10 €
Home Delivered Parcel11,70 €
Matkahuolto Near Parcel6,20 €
Matkahuolto Bus Parcel4,10 €
ACER
KC.20301.DEG
3 months
More info about this product
Specifications
Processor
Processor modelG2030
Processor lithography22 nm
Processor familyIntel Pentium
Box
Processor socketLGA 1155
SteppingP0
Processor cores2
L3 cache speed3 GHz
System bus rate5 GT/s
Processor threads2
Compatible chipsetsIntel B65 Express, Intel H61 Express, Intel H77 Express, Intel Q75 Express, Intel Q77 Express, Intel Z75 Express, Intel Z77 Express
Processor operating modes64-bit
Component forPC
Processor cache3 MB
Bus typeDMI
Processor frequency3 GHz
Processor cache typeL3
Memory
Maximum internal memory supported by processor32 GB
Memory types supported by processorDDR3-SDRAM
Memory clock speeds supported by processor1333 MHz
Memory bandwidth supported by processor (max)21 GB/s
Memory channels supported by processorDual
ECC supported by processor
Other features
Intel® Virtualization Technology (Intel® VT)VT-x
Graphics
On-board graphics adapter modelIntel® HD Graphics
On-board graphics adapter
On-board graphics adapter base frequency650 MHz
On-board graphics adapter dynamic frequency (max)1050 MHz
Number of displays supported (on-board graphics)3
Processor special features
Intel® Smart Cache
Enhanced Intel SpeedStep Technology
Intel VT-x with Extended Page Tables (EPT)
Intel Virtualization Technology (VT-x)
Conflict Free processor
Features
Supported instruction setsSSE4.1,SSE4.2
Processor codeSR163
PCI Express slots version2.0
Execute Disable Bit
Idle States
Thermal Monitoring Technologies
CPU configuration (max)1
Graphics & IMC lithography22 nm
PCI Express configurations1x16,2x8,1x8+2x4
Thermal Design Power (TDP)55 W
Thermal solution specificationPCG 2011C
Processor package size37.5
EAN5712505170564
Read more...
Description

Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Thermal Solution Specification
Intel Reference Heat Sink specification for proper operation of this SKU.v

Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Read more...

No price development information for this product.