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|Processor front side bus||1333 MHz|
|Processor lithography||32 nm|
|Processor family||Intel® Xeon® 5000 Sequence|
|Processor socket||LGA 1366|
|CPU multiplier (bus/core ratio)||21|
|System bus rate||6.4 GT/s|
|Processor operating modes||64-bit|
|Processor boost frequency||3.2 GHz|
|Processor cache||12 MB|
|Processor frequency||2.8 GHz|
|Processor cache type||L3|
|Maximum internal memory supported by processor||288 GB|
|Memory clock speeds supported by processor||800,1066,1333 MHz|
|Memory bandwidth supported by processor (max)||32 GB/s|
|Memory channels supported by processor||Triple|
|ECC supported by processor|
|VID Voltage Range||0.75 - 1.35 V|
|Maximum operating temperature||81.3 °C|
|Thermal Design Power (TDP)||95 W|
- Intel's latest-generation microarchitecture represents the next step in unprecedented processor performance and dynamic scalability. Designed from the ground up to take advantage of hafnium-based Intel® 32nm hi-k metal gate silicon technology, Intel® Microarchitecture (Westmere) unleashes parallel processing performance enabled by Intel® QuickPath technology providing an integrated memory controller and high-speed interconnect per independent processing core.
- Dynamic scalability, managed cores, threads, cache, interfaces, and power for energy-efficient performance on demand.
- Design and performance scalability for servers, workstations, notebooks and desktops with support for 4-12 cores and up to 24+ threads with Intel® Hyper-Threading Technology (Intel® HT Technology), and scalable cache sizes, system interconnects, and integrated memory controllers.
- Intel® Turbo Boost Technology delivers additional performance automatically when needed by taking advantage of the processor's power and thermal headroom. This enables increased performance of both multi-threaded and single-threaded workloads.