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Flex x220 E5-2403 4C 4GB

Valmistaja: IBM
ID: 7906C2G
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Tuotetiedot
Kuvaus
Myymäläsaatavuus
Toimitus
Hinnan muutokset
Prosessori
ProsessorimalliE5-2403
Emolevyn piirisarjaIntel C600
Asennettujen prosessorien lukumäärä1
Prosessorin litografia32 nm
SMP-suorittimien enimmäismäärä2
SuoritinperheIntel® Xeon® E5 Family
Prosessorin kantaLGA 1356
KellotusM1
Tuetut ohjepaketitAVX
Prosessorin ytimet4
Prosessorin ydinSR0LS
Järjestelmän väylänopeus6,4 GT/s
Prosessorin säikeet4
Prosessorin käyttötilat64-bittinen
Prosessorin välimuisti10 MB
Execute Disable Bitcheckmark
Joutotilatcheckmark
Thermal Monitoring -teknologiacheckmark
Skaalautuvuus2S
FSB-pariteetticross
Saatavilla olevat upotetut vaihtoehdotcross
VäylätyyppiQPI
QPI-linkkien lukumäärä1
Prosessorin taajuus1,8 GHz
Thermal Design Power (TDP)80 W
Prosessorin koodinimiSandy Bridge EN
PCI Express -väylien enimmäismäärä24
Prosessorin välimuistityyppiSmart Cache
ProsessorisarjaIntel Xeon E5-2400
Prosessorin tukema suurin sisäinen muisti375 GB
Prosessorin tukemat muistityypitDDR3-SDRAM
Prosessorin tukemat muistin kellonopeudet800,1066 MHz
Prosessorin tukema muistin kaistanleveys (maks.)25 GB/s
Prosessorin tukemat muistikanavatKolmen hengen huone
Prosessori tukee ECC:tächeckmark
Prosessorin pakkauskoko45 mm
Conflict Free -prosessoricross
Muisti
Sisäisen muistin tyyppiDDR3-SDRAM
Muistipaikat12
Sisäinen enimmäismuisti384 GB
ECCcheckmark
Muistin kellotaajuus1066 MHz
Muistin sijoittelu (paikat x koko)1 x 4 GB
Sisäinen muisti4 GB
Liitettävyys
Sarjaporttien määrä1
USB 2.0 -porttien määrä1
Ethernet LAN (RJ-45) -portit2
Paino ja mitat
Paino6,4 kg
Tuotteen korkeus492 mm
Tuotteen leveys217 mm
Tuotteen syvyys56 mm
Virranhallinta
Vikasietoisen virtalähteen tuki (RPS)checkmark
Ympäristöolosuhteet
Käyttökorkeus0 - 3048 m
Käytön suhteellinen kosteus (H-H)8 - 85%
Varastointilämpötila1 - 60 °C
Käyttölämpötila (T-T)5 - 40 °C
Säilytysympäristön kosteus5 - 100%
Käytön ulkopuolinen korkeus0 - 10700 m
Verkko
Kaapelitekniikka10/100/1000Base-T(X)
Ethernet LANcheckmark
Wake-on-LAN -valmiuscheckmark
Ethernet-liitännän tyyppiGigabitti Ethernet
Tallennusväline
HDD-käyttöliittymäSATA
RAID-tasot0, 1
HDD-koko2.5"
Tuettujen HDD:iden lukumäärä2
Hot-swapcheckmark
SSD-liittymäSATA, Serial ATA II, Serial ATA III, Sarjaankytketty SCSI
Tallennuksen enimmäiskapasiteetti2 TB
S.M.A.R.T. tukicheckmark
Tuetut HDD-koot2.5"
RAID-tukicheckmark
Tuettujen SSD:iden lukumäärä2
Pakkaustiedot
Pakkauksen paino8 kg
Pakkauksen syvyys603 mm
Pakkauksen korkeus197 mm
Pakkauksen leveys430 mm
Sertifikaatit
SertifiointiASHRAE Class A3
FCC Part 15 Class A
Canada ICES-004, Issue 3 Class A
UL/IEC 60950-1
CSA C22.2 No.60950-1
NOM-019
Argentina IEC60950-1
Japan VCCI, Class A
IEC60950-1 (CB Certificate, CB Test Report)
China CCC (GB4943); (GB9254, Class A); (GB17625.1)
Taiwan BSMI CNS13438, Class A; CNS14336
Australia/New Zealand AS/NZS CISPR22, Class A
Korea KN22, Class A, KN24
Russia/GOST ME01, IEC 60950-1, GOST R51318.22, GOST R 51318.249, GOST R 51317.3.2, GOST R 51317.3.3
IEC 60950-1 (CB Certificate, CB Test Report)
CE Mark (EN55022 Class A, EN60950-1, EN55024, EN61000-3-2, EN61000-3-3) CISPR22, Class A
TUV-GS (EN60950-1/IEC60950-1, EK1-ITB2000)
Ohjelmisto
Yhteensopivat käyttöjärjestelmätWindows Server 2008 R2
Red Hat Enterprise Linux 5/ 6
SUSE Linux Enterprise Server 10/ 11
VMware ESX 4.1/ 5
Käyttöjärjestelmä asennettucross
Laajennuspaikat
PCI Express x8 korttipaikkoja2
PCI Express korttipaikan versio3.0
Muut ominaisuudet
NäytönohjainG200eR2
NäytönohjainperheMatrox
Intel® Virtualization -teknologia (Intel® VT)VT-d,VT-x
Suunnittelu
Telineasennuscheckmark
AlustatyyppiTerä
Optisen aseman tyyppiN
Ylimääräinen tuulettimien tukicheckmark
Grafiikka
Näytönohjaimen enimmäismuisti16 MB
Suorittimen erityispiirteet
Intel® My WiFi -teknologia (Intel® MWT)cross
Intel® Anti-Theft -teknologia (Intel® AT)cross
Intel® vPro™ -teknologiacheckmark
Intel® Hyper-Threading -teknologia (Intel® HT Technology)cross
Intel® Turbo Boost -teknologiacross
Intel® Quick Sync Video -teknologiacross
Intel® InTru™ 3D -teknologiacross
Intel® Wireless Display (Intel® WiDi)cross
Intel® FDI -teknologiacross
Intel® Clear Video HD -teknologia (Intel® CVT HD)cross
Intel® Dual Display Capable -teknologiacross
Intel® Insider™cross
Intel® Fast Memory Accesscross
Intel® Flex Memory Accesscheckmark
Intel® Smart Cachecheckmark
Intel® AES New Instructions (Intel® AES-NI)checkmark
Enhanced Intel SpeedStep Technologycheckmark
Intel® Trusted Execution -teknologiacheckmark
CPU-kokoonpano (maks.)2
Intel® Enhanced Halt Statecheckmark
Intel® Clear Video Technology MID (Intel® CVT for MID)cross
Intel® VT-x, jossa Extended Page Tables (EPT)checkmark
Intel® Demand Based Switchingcheckmark
Intel® Rapid Storage -teknologiacross
Intel® 64checkmark
Intel® Virtualization Technology for Directed I/O (VT-d)checkmark
Intel® Clear Video Technologycross
Intel® Identity Protection Technology-versio0,00
Intel® Virtualization Technology (VT-x)checkmark
ARK ID -prosessori64615
Suorituskyky
Plug & Play -yhteensopivacheckmark
Trusted Platform Module (TPM)checkmark
Tuki paikan päällächeckmark
Runkoon sopiva levycheckmark
Trusted Platform Module (TPM) versio1.2
EAN5051045112048
Takuu1 vuosi
Source: Icecat.biz
The IBM® Flex System™ x220 Compute Node is the next generation cost-optimized compute node designed for less demanding workloads and low-density virtualization. The x220 is efficient and equipped with flexible configuration options and advanced management to run a broad range of workloads.

Suggested use: For clients looking to deploy an entry virtualization solution as part of a larger data center infrastructure.

IBM Flex System is a new category of computing that integrates multiple server architectures, networking, storage, and system management capability into a single system that is easy to deploy and manage. IBM Flex System has full and built-in virtualization support of servers, storage, and networking to speed provisioning and increased resiliency. In addition, it supports open industry standards, such as operating systems, networking and storage fabrics, virtualization, and system management protocols, to easily fit within existing and future data center environments. IBM Flex System is scalable and extendable with multigenerational upgrades to protect and maximize IT investments.

Scalability and performance

The x220 offers numerous features to boost performance, improve scalability, and reduce costs:

The Intel Xeon processor E5-2400 product family improves productivity by offering affordable dual-socket system performance with eight-core processors with up to 2.3 GHz core speeds, up to 20 MB of L3 cache, and one QPI interconnect link of up to 8 GTps.

Up to two processors, 16 cores total, and 32 threads maximize the concurrent execution of multithreaded applications.

Intelligent and adaptive system performance with Intel Turbo Boost Technology 2.0 allows processor cores to run at maximum speeds during peak workloads by temporarily going beyond processor Thermal Design Power (TDP).

Intel Hyper-Threading Technology boosts performance for multithreaded applications by enabling simultaneous multithreading within each processor core, up to two threads per core.

Intel Virtualization Technology integrates hardware-level virtualization hooks that allow operating system vendors to better use the hardware for virtualization workloads.

Intel Advanced Vector Extensions (AVT) improve floating point performance for compute-intensive technical and scientific applications compared to Intel Xeon 5600 series processors.

There are 12 DIMM sockets supporting low profile (LP) RDIMMs, UDIMMs and LRDIMMs, with a total capacity of up 384 GB using 32 GB LRDIMMs

Supports memory speeds of up to 1600 MHz to maximize memory performance.
Support for 1.8-inch solid-state drives to maximize I/O operations per second (IOPS) and significantly improve application performance.

The theoretical maximum memory bandwidth of the Intel Xeon processor E5-2400 product family is 38.4 GBps, which is 20% more than in the previous generation of Intel Xeon 5600 processors.
The server offers PCI Express 3.0 I/O expansion capabilities that improve the theoretical maximum bandwidth by 60% (8 GTps per link) compared to the previous generation of PCI Express 2.0.

With Intel Integrated I/O Technology, the PCI Express 3.0 controller is integrated into the Intel Xeon processor E5 family. This integration reduces I/O latency and increases overall system performance.
Support for high-bandwidth I/O adapters, up to two in each x220 Compute Node. Support for 10 Gb Ethernet, 16 Gb Fibre Channel, and FDR InfiniBand expansion cards.

Supports the PCIe Expansion Node for support for up to six additional I/O adapters.

Availability and serviceability

The x220 provides many features to simplify serviceability and increase system uptime:
Chipkill, memory mirroring, and memory rank sparing for redundancy in the event of a non-correctable memory failure.

Tool-less cover removal provides easy access to upgrades and serviceable parts, such as processor, memory, and adapter cards.

Hot-swap drives supporting integrated RAID 1 redundancy for data protection and greater system uptime.

A light path diagnostics panel and individual light path LEDs lead the technician to failed (or failing) components. These features simplify servicing, speeds up problem resolution, and helps improve system availability.

Predictive Failure Analysis (PFA) detects when system components (such as processors, memory, and hard disk drives) operate outside of standard thresholds and generates proactive alerts in advance of possible failure, therefore increasing uptime.

Solid-state drives (SSDs), which offer significantly better reliability than traditional mechanical HDDs for greater uptime.

A built-in Integrated Management Module II (IMM2) continuously monitors system parameters, triggers alerts, and performs recovery actions in case of failures to minimize downtime.
Built-in diagnostics using Dynamic Systems Analysis (DSA) Preboot speeds up troubleshooting tasks to reduce service time.

Three-year customer replaceable unit and on-site limited warranty, next business day 9x5. Optional service upgrades are available.

Manageability and security

Powerful systems management features simplify local and remote management of the x220:
The server includes an Integrated Management Module II (IMM2) to monitor server availability and perform remote management.

An integrated industry-standard Unified Extensible Firmware Interface (UEFI) enables improved setup, configuration, and updates, and simplifies error handling.

Integrated Trusted Platform Module (TPM) V 1.2 support enables advanced cryptographic functionality, such as digital signatures and remote attestation.

Industry-standard AES NI support for faster, stronger encryption.

Integrates with the IBM® Flex System™ Manager for proactive systems management. It offers comprehensive systems management for the entire IBM Flex System platform, increasing uptime, reducing costs, and improving productivity through advanced server management capabilities.
IBM Fabric Manager simplifies the deployment of infrastructure connections by managing network and storage address assignments.

Intel Execute Disable Bit functionality can help prevent certain classes of malicious buffer overflow attacks when combined with a supporting operating system.
Intel Trusted Execution Technology provides enhanced security through hardware-based resistance to malicious software attacks, allowing an application to run in its own isolated space protected from all other software running on a system.

Energy efficiency

The x220 offers the following energy-efficiency features to save energy, reduce operational costs, increase energy availability, and contribute to a green environment:
Component-sharing design of the IBM Flex System chassis provides ultimate power and cooling savings.

The Intel Xeon processor E5-2400 product family offers better performance over the previous generation while fitting into the same TDP limits.
Intel Intelligent Power Capability powers individual processor elements on and off as needed, to reduce power draw.

Low-voltage Intel Xeon processors draw less energy to satisfy demands of power and thermally constrained data centers and telecommunication environments.
Low-voltage 1.35 V DDR3 memory RDIMMs consume 15% less energy than 1.5 V DDR3 RDIMMs.
Solid-state drives (SSDs) consume as much as 80% less power than traditional spinning 2.5-inch HDDs.

The server uses hexagonal ventilation holes, a part of IBM Calibrated Vectored Cooling™ technology. Hexagonal holes can be grouped more densely than round holes, providing more efficient airflow through the system.

Active Energy Manager provides advanced power management features with actual real-time energy monitoring, reporting, and capping features.

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