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CPU.DUO-P7570/2.26G/1066/R0
573,90 €
inkl. 24% moms
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Uppskattad leveranstidObekräftad
från 3,90 €
Avhämtning från butiken0,00 €
Postens paketautomat3,90 €
Postpaket5,60 €
Till dörren-paket11,10 €
Hempaket11,70 €
Matkahuolto Närpaket6,20 €
Matkahuolto Busspaket4,10 €
ACER
KC.75701.DPP
3 månader
Mer info om denna produkt
Produktspecifikation
Processor
ProcessorP7570
Processor busshastighet1066 MHz
Processorlitografi45 nm
ProcessorfamiljIntel Core 2 Duo
Låda
Processorsockel478
StegningR0
Processor antal kärnor2
L2-cache hastighet2.26
kompatibla chipsetIntel GM45 Express, Intel PM45 Express
Processor driftlägen64-bitars
Komponent förBärbar dator
Processorns cache3 MB
Processorfrekvens2,26 GHz
Processorns cachetypL2
Miljökrav
T-junction105 ° C
Övriga egenskaper
Intel® Virtualization Technology (Intel® VT)VT-x
Processor specialfunktioner
Enhanced Intel Speedstep Technology
Intel Virtualization Technology (VT-x)
Egenskaper
Processor kodSLGLW
Execute Disable Bit-säkerhet
Idle stater
Termiska övervakningsteknik
Antal behandlingar Die Transistorer410 M
Bearbetning dö storlek107 mm ²
Grafik & IMC litografi45 nm
Värmeavledningseffekt (TDP)25 W
EAN
Source: Icecat.biz
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Beskrivning

Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

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