Cooler Master HTK-002-U1-GP Thermal Paste, White

The Cooler Master HTK-002-U1-GP (White) is a thermal interface material designed to facilitate heat transfer between processors and cooling solutions. With a thermal conductivity of 4.5 W/m·K, the compound fills microscopic air gaps on the surfaces of CPUs and GPUs. It offers a thermal resistance of 0.8 °C/W to help maintain heat dissipation under load. The grease ensures consistent contact between hardware components and heatsinks, and is typically applied during PC assembly or maintenance.

The formulation is non-conductive and non-bleeding, which prevents electrical shorts if the material contacts motherboard traces and ensures it stays in place over time. The kit includes a spatula to assist with applying a thin, even layer across the heat spreader. The paste is suitable for various heat-generating components in standard desktop systems.

• 4.6 g of compound is sufficient for multiple desktop CPU applications.
• Density of 2.37 g/cm³ ensures a consistent material structure for uniform thermal performance.
• Viscosity of 1400 P at 25°C maintains a stable consistency that resists running or dripping.
• White colour allows for easy verification of coverage during application.
• Supplied as a kit containing the thermal grease and an applicator tool.