logo Multitronic Oy
Korsholmanpuistikko 38
65100 Vaasa
Web: www.multitronic.fi
Telephone: 06 - 319 77 00
E-mail: info@multitronic.fi
Xeon Lfd Qc X3450 2.67 Ghz 8M
567,90 €
incl. 24% VAT
Currently not available
Multitronic warehouse0
Multitronic - JNT Vaasa0
Multitronic - JNT Pietarsaari0
iTronic Vaasa0
iTronic Seinäjoki0
Multitronic / iTronic Lappeenranta0
Multitronic / iTronic Jyväskylä0
Multitronic Mariehamn0
Supplier0
Estimated delivery timeNot confirmed
from 3,90 €
Fetch from the shop0,00 €
Posti Parcel Point3,90 €
Postal Parcel5,60 €
Parcel to the Doorstep11,10 €
Home Delivered Parcel11,70 €
Matkahuolto Near Parcel6,20 €
Matkahuolto Bus Parcel4,10 €
HEWLETT-PACKARD
590324-001
1 year
More info about this product
Specifications
Processor
Processor modelX3450
Processor lithography45 nm
Processor familyIntel® Xeon® 3000 Sequence
Box
Processor socketLGA 1156 (Socket H)
Processor cores4
System bus rate2.5 GT/s
Processor threads8
Compatible chipsetsIntel 3400, Intel 3420, Intel 3450
Processor operating modes64-bit
Processor boost frequency3.2 GHz
Component forServer/workstation
Processor cache8 MB
Bus typeDMI
Processor frequency2.66 GHz
Processor cache typeL3
Memory
Maximum internal memory supported by processor32 GB
Memory types supported by processorDDR3-SDRAM
Memory clock speeds supported by processor800,1066,1333 MHz
Memory bandwidth supported by processor (max)21 GB/s
Memory channels supported by processorDual
ECC supported by processor
Energy management
VID Voltage Range0.65 - 1.4 V
Operational conditions
Tcase72.7 °C
Other features
Intel® Virtualization Technology (Intel® VT)VT-d,VT-x
Graphics
On-board graphics adapter
Processor special features
Intel® Hyper Threading Technology (Intel® HT Technology)
Intel® Turbo Boost Technology
Intel® Smart Cache
Enhanced Intel SpeedStep Technology
Intel Trusted Execution Technology
Intel VT-x with Extended Page Tables (EPT)
Intel Demand Based Switching
Intel Virtualization Technology for Directed I/O (VT-d)
Intel Virtualization Technology (VT-x)
Features
Supported instruction setsSSE4.2
PCI Express slots version2.0
Execute Disable Bit
Idle States
Thermal Monitoring Technologies
Physical Address Extension (PAE)
CPU configuration (max)1
Number of Processing Die Transistors774 M
Embedded options available
Processing Die size296 mm²
PCI Express configurations1x16,2x8,4x4
Thermal Design Power (TDP)95 W
Maximum number of PCI Express lanes1
EAN
Source: Icecat.biz
Read more...
Description

The Intel® Xeon® processor 3000 series-based platforms unleash the computing power of Intel® Xeon® processors. Based on the next-generation Intel® microarchitecture, codenamed Nehalem, these processors provide your business with exceptional performance and power efficiency at a very affordable cost.

The Intel Xeon 3000 processor-based servers protect critical business information and offer the performance and headroom to make employees and businesses more productive, making them ideal for small and medium business owners looking for ways to support rapid business growth on small technology budgets.

Designed for needs of entry-level servers, the Intel® Xeon® processor 3400 series adapts to application behavior by automatically adjusting processing power to deliver maximum performance, protecting valuable assets from data corruption and loss, improving productivity with business growth.

DDR3 memory support up to 1333 MHz
- Supports up to thirty-two GB dual-channel DDR3 Error Correcting Code (ECC) memory which checks and corrects system memory errors;
- Flexible memory configuration options with support for up to four non-ECC or ECC unregistered DIMMs or up to six ECC Registered DIMMs.

Integrated PCI-Express 2.0 I/O
- Integrated serial I/O technology provides a direct connection between the processor and PCI Express component/adapters with bandwidth up to 8 GB/s on PCI-Express 2.0 x16 interface;
- The PCI-Express 2.0 x16 interface can be bifurcated to either two x8 PCI Express or four x4 PCI-Express interfaces for maximum design flexibility.

PCI-Express offers higher bandwidth, lower latency, and fewer I/O bottlenecks than PCI and PCI-X.

Read more...

No price development information for this product.