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CPU.INTEL.XEON.E3-1240.3.3G

KC.12401.XE3
1177,90 €
Visa price: inkl. Moms exkl. Moms
Webblager:
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Uppskattad leveranstid: Obekräftad
Leveranskostnad: från 3,90 €
Avhämtning från butiken0,00 €
Postens paketautomat3,90 €
Postpaket5,60 €
Till dörren-paket11,10 €
Hempaket11,70 €
Matkahuolto Närpaket6,20 €
Matkahuolto Busspaket4,10 €
Butiker:välj
Obekräftad
Produktspecifikation
Processor
ProcessorE3-1240
Processorlitografi32 nm
ProcessorfamiljIntel Xeon
Lådacross
ProcessorsockelLGA 1155
StegningD2
Processorkärnor4
Processor kodSR00K
L3-cache hastighet3,3 GHz
Systembuss5 GT/s
Processor antal trådar8
kompatibla chipsetIntel C202, Intel C204, Intel C206, Intel C216
Processor driftlägen64-bit
Processorboostfrekvens3,7 GHz
Komponent förServer/arbetsstation
Processorns cache8 MB
BusstypDMI
Processorfrekvens3,3 GHz
Processorns cachetypL3
Minne
Högsta internminne som stöds av processorn32 GB
Minnestyper som stöds av processornDDR3-SDRAM
Minnesklockfrekvens som stöds av processorn1066,1333 MHz
Minnesbandbredd som stöds av processorn (max)21 GB/s
Minneskanaler som stöds av processornDual
Processor med ECC-stödcheckmark
Vikt & dimension
Processorns förpackningsstorlek37.5
Strömtillförsel
Värmeavledningseffekt (TDP)80 W
Miljökrav
TCASE69,1 ° C
Övriga egenskaper
Intel® Virtualization Technology (Intel® VT)VT-d,VT-x
Processor specialfunktioner
Intel® Identity Protection Technology (Intel® IPT)checkmark
Intel® vPro™ -teknikcheckmark
Intel® Hyper Threading Technology (Intel® HT Technology)checkmark
Intel® Turbo Boost Technology2.0
Intel® Snabb Memory Accesscheckmark
Intel® Flex minnesåtkomstcheckmark
Intel® Smart Cachecheckmark
Intel® AES nya instruktioner (Intel® AES-NI)checkmark
Enhanced Intel Speedstep Technologycheckmark
Intel® Trusted Execution Technologycheckmark
Intel® VT-x med utökad Sida Tabeller (EPT)checkmark
Intel® Efterfrågan Baserad Växlacheckmark
Intel® Virtualization Technology for Directed I/O (VT-d)checkmark
Intel Virtualization Technology (VT-x)checkmark
Egenskaper
Stödda instruktionstyperAVX,SSE4.1,SSE4.2
PCI Express-kortplatser version2.0
Execute Disable Bit-säkerhetcheckmark
Idle statercheckmark
Termiska övervakningsteknikcheckmark
CPU konfiguration (max)1
Grafik & IMC litografi32 nm
Högsta antal PCI Express-platser20
EAN
Source: Icecat.biz
Beskrivning

System Bus
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.

Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Instruction Set Extensions
Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Max Turbo Frequency
Max turbo frequency is the maximum single core frequency at which the processor is capable of operating using Intel Turbo Boost Technology. Frequency is measured in gigahertz (GHz), or billion cycles per second.

TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

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