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CPU.INTEL.XEON.E3-1240.3.3G

Manufacturer: ACER
ID: KC.12401.XE3
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Processor
Processor modelE3-1240
Processor lithography32 nm
Processor familyIntel Xeon
Boxcross
Processor socketLGA 1155
SteppingD2
Processor cores4
Processor codeSR00K
L3 cache speed3.3 GHz
System bus rate5 GT/s
Processor threads8
Compatible chipsetsIntel® C202, Intel® C204, Intel® C206, Intel® C216
Processor operating modes64-bit
Processor boost frequency3.7 GHz
Component forServer/Workstation
Processor cache8 MB
Bus typeDMI
Processor frequency3.3 GHz
Processor cache typeL3
Memory bandwidth supported by processor (max)21 GB/s
Memory
ECCcheckmark
Memory channelsDual-channel
Maximum internal memory supported by processor32 GB
Memory types supported by processorDDR3-SDRAM
Memory clock speeds supported by processor1066,1333 MHz
Weight & dimensions
Processor package size37.5 mm
Energy management
Thermal Design Power (TDP)80 W
Operational conditions
Tcase69.1 °C
Other features
Intel® Virtualization Technology (Intel® VT)VT-d,VT-x
Processor special features
Intel® Identity Protection Technology (Intel® IPT)checkmark
Intel® Hyper Threading Technology (Intel® HT Technology)checkmark
Intel® Turbo Boost Technology2.0
Intel Fast Memory Accesscheckmark
Intel Flex Memory Accesscheckmark
Intel® Smart Cachecheckmark
Intel® AES New Instructions (Intel® AES-NI)checkmark
Enhanced Intel SpeedStep Technologycheckmark
Intel Trusted Execution Technologycheckmark
Intel VT-x with Extended Page Tables (EPT)checkmark
Intel Demand Based Switchingcheckmark
Intel Virtualization Technology for Directed I/O (VT-d)checkmark
Intel Virtualization Technology (VT-x)checkmark
Features
Supported instruction setsAVX,SSE4.1,SSE4.2
PCI Express slots version2.0
Execute Disable Bitcheckmark
Idle Statescheckmark
Thermal Monitoring Technologiescheckmark
CPU configuration (max)1
Graphics & IMC lithography32 nm
Maximum number of PCI Express lanes20
EAN
Warranty3 months
Source: Icecat.biz

System Bus
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.

Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Instruction Set Extensions
Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Max Turbo Frequency
Max turbo frequency is the maximum single core frequency at which the processor is capable of operating using Intel Turbo Boost Technology. Frequency is measured in gigahertz (GHz), or billion cycles per second.

TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

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