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Formula 6 thermal compound

Manufacturer: ANTEC
ID: 0-761345-77060-6
Product unavailable
This product is end of life or currently not available.
Specifications
Description
Store availability
Delivery
Price development
Technical details
Thermal conductivity5.3 W/m·K
Weight & dimensions
Weight4 g
Operational conditions
Operating temperature (T-T)-30 - 250 °C
EAN761345770606
Warranty1 year
Source: Icecat.biz

Antec’s Formula 6 thermal compound protects your CPU even when your rig is running on all cylinders. Since little of the CPU’s surface actually touches the heat sink, you need a solution that isolates and facilitates the transfer of heat. Formula 6’s nano diamond particles minimize the distance between heat-conductive compounds and gladly take on the highest demanding CPU, optimally performing between -30°C and 250°C. To keep your system cool and your CPU functioning comfortably, pick up Antec’s Formula 6 for a diamond-caliber solution.

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