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Cooler Master HYPER 612V2

Manufacturer: COOLER MASTER
ID: RR-H6V2-13PK-R1
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Key Specifications

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Specifications
Description
Store availability
Delivery
Price development
Weight & dimensions
Weight886 g
Package weight1.4 kg
Height160 mm
Width150 mm
Depth129 mm
Package depth208 mm
Package height190 mm
Package width192 mm
Heatsink weight732 g
Fan dimensions (W x D x H)120 x 120 x 25 mm
Energy management
Power consumption (typical)1.08 W
Maximum current0.09 A
Voltage12 V
Other features
Product life40000 h
Heatsink dimensions (W x D x H)139 x 102 x 160.4 mm
Design
Product colourBlack
Number of heat pipes6
Performance
TypeCooler
Mean time between failures (MTBF)40000 h
Fan diameter12 cm
Supported processor socketsSocket AM2, Socket AM2+, Socket AM3, Socket AM3+, Socket FM1, Socket FM2, Socket FM2+, LGA 1151 (Socket H4), LGA 2011-v3 (Socket R)
Suitable locationProcessor
Maximum airflow44.2 cfm
Minimum airflow (imperial)26.6 cfm
Minimum air pressure0.6 mmH2O
Maximum air pressure1.6 mmH2O
Noise level (low speed)11 dB
Noise level (high speed)20 dB
Rotational speed (max)1300 RPM
Rotational speed (min)800 RPM
EAN4719512047828
Warranty1 year
Source: Icecat.biz

The Cooler Master Hyper 612 Ver.2 provides excellent CPU cooling performance. It features a large fin structure that accelerates heat dissipation by maximizing surface area. Hyper 612 Ver.2's intelligent 120mm PWM fan ensures a low noise solution. Six direct contact heatpipes and folding fin structure effectively guides air and provides an accelerated cooling system.

The Cooler Master Hyper 612 Ver.2 provides excellent CPU cooling performance. It features a large fin structure that accelerates heat dissipation by maximizing surface area. Hyper 612 Ver.2's intelligent 120mm PWM fan ensures a low noise solution. Six direct contact heatpipes and folding fin structure effectively guides air and provides an accelerated cooling system.

DIRECT THERMAL TRANSFER
Six (6) Direct Contact Heatpipes for accelerated surface to surface thermal transfer.

EXCELLENT HEAT DISTRIBUTION
Folding Fin Structure for the best air guiding, increased efficiency and heat dissipation

X-VENT TECHNOLOGY
Air-Guide design places 45 degree angled vents around each Direct Contact Heatpipe for better cooling.

EASY INSTALLATION
Easy-to-use, universal mounting system for all common Intel and AMD platforms.

MEASUREMENT DIAGRAM
Hyper 612 V2 optimized profile for greater mid tower compatibility and memory clearance.

COVERAGE
Parts, product replacement, and free technical support.

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