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Key Specifications
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Specifications
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Technical details | |
Device type | SSD |
Weight & dimensions | |
Weight | 30 g |
Height | 3 mm |
Width | 22 mm |
Depth | 80 mm |
Energy management | |
Operating voltage | 3.3 V |
Power consumption (idle) | 0.03 W |
Power consumption (read) | 6.9 W |
Power consumption (write) | 5.6 W |
Operational conditions | |
Storage temperature (T-T) | -40 - 85 °C |
Operating temperature (T-T) | 0 - 70 °C |
Operating shock | 1500 G |
Operating vibration | 20 G |
Packaging data | |
Package depth | 11.5 mm |
Package height | 127 mm |
Package width | 75 mm |
Package type | Box |
Performance | |
Drive capacity | 960 GB |
Features | |
Drive capacity | 960 GB |
Interface | PCI Express 3.0 |
Security algorithms | 256-bit AES |
Mean time between failures (MTBF) | 1800000 h |
Memory type | 3D TLC NAND |
Read speed | 3480 MB/s |
Write speed | 3000 MB/s |
S.M.A.R.T. support | |
TRIM support | |
Random write (4KB) | 570000 IOPS |
Random read (4KB) | 610000 IOPS |
Component for | PC/Laptop |
PCI Express interface data lanes | x4 |
TBW rating | 1700 |
SSD form factor | M.2 |
NVMe | |
NVMe version | 1.3 |
DevSlp (device sleep) support | |
EAN | 840006623069 |
Warranty | 5 years |
EXTREME STORAGE PERFORMANCE
All-new extreme data performance controller delivers up to 3,480MB/sec sequential read, and up to 3,000MB/s sequential write, for blazing fast read, write and response times.
HIGH-SPEED NVME PCIE GEN3 x4 M.2 INTERFACE
For simple connection and maximum bandwidth.
HIGH-DENSITY 3D TLC NAND
Provides the ideal mix of performance, endurance and value to keep your drive performing at its best for years.
COMPACT M.2 2280 FORM FACTOR
Ultra-compact M.2 2280 size fits directly into your notebook or motherboard with no additional cables or connectors.
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Multitronic | JNT Pietarsaari: 0 pcs
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Multitronic Seinäjoki: 0 pcs
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Multitronic | iTronic Jyväskylä: 0 pcs
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Multitronic | iTronic Lappeenranta: 0 pcs
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Multitronic Mariehamn: 0 pcs
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