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| Technical details | |
| Compliance certificates | RoHS |
| Weight & dimensions | |
| Weight | 3 g |
| Packaging data | |
| Package depth | 20 mm |
| Package height | 10 mm |
| Package width | 120 mm |
| Quantity per pack | 1 pc(s) |
| Features | |
| Type | Thermal paste |
| Certification | CE |
| Operating temperature (T-T) | -30 - 280 °C |
| Product colour | Black, Red, White |
| Thermal resistance | 0.201 °C/W |
| Viscosity note | 73 CPS |
| Thermal conductivity | 5.15 W/m·K |
| EAN | 4044953501074 |
Xilence X5 thermal paste was specifically designed for high-end processors. The very high thermal conductivity ensures for an efficient heat exchange and low temperatures! The paste works reliably at temperatures from -50 to +300°C – therefore, it is particularly well suited for extreme overclocking. Since the X5 is not electrically conductive, there is no danger for the surrounding hardware! Contents: 2.5 g.
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The above technical details are for reference only and may change without notice. We reserve the right to correct printing errors and use illustrations for guidance. Some text may be auto-generated or machine-translated, which could lead to inaccuracies.