Thermal Grizzly Minus Pad 8 100 x 100 x 1.5 mm 2-pack Thermal Pad, Pink
Manufacturer: THERMAL GRIZZLY
ID: TG-MP8-100-100-15-2R
1690€
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Multitronic Vaasa
Multitronic Pietarsaari
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Multitronic Mariehamn
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| Weight & dimensions | |
| Weight | 59 g |
| Height | 1.5 mm |
| Width | 100 mm |
| Depth | 100 mm |
| Thickness | 1.5 mm |
| Packaging data | |
| Quantity per pack | 2 pc(s) |
| Design | |
| RoHS compliance |  |
| Features | |
| Compatibility | Thermal interface for electronic components requiring a pad-style contact layer |
| Material | Silicon-based thermal compound with ceramic components (nano aluminum oxide / metal oxides) |
| Product colour | Pink |
| Easy to install | |
| Thermal conductivity | 8 W/m·K |
| Suitable for | Bridging contact gaps between heat sources (e.g., chips) and cooling elements such as heatsinks |
| Minimum operating temperature | -100 °C |
| Product type | Thermal pad |
| Best uses | Replacing or supplementing thermal paste with a pad for chip-level heat transfer and gap compensation |
| Non-conductive | |
| EAN | 4260711991660 |
The Thermal Grizzly Minus Pad 8 is used to fill gaps between heat sources and cooling components. With a thermal conductivity of 8 W/m·K, it is electrically nonconductive and safe for use near sensitive electronics. Each 100 x 100 mm pad is 1.5 mm thick and made from a silicone-based compound containing ceramic metal oxides. These RoHS-compliant pads are supplied in packs of two and remain effective at temperatures as low as -100 °C.
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The above technical details are for reference only and may change without notice. We reserve the right to correct printing errors and use illustrations for guidance. Some text may be auto-generated or machine-translated, which could lead to inaccuracies.