Thermal Grizzly Minus Pad 8, 30 x 30 x 2.5mm Thermal Pad, Pink

The Thermal Grizzly Minus Pad 8 (30 x 30 x 2.5 mm) is a thermal interface used to bridge gaps between electronic components and cooling hardware. It uses a ceramic-silicon formula with nano aluminum oxide to transfer heat from the source to the cooling unit. With a thermal conductivity of 8 W/m·K, it maintains consistent heat transfer even under high loads. The flexible, pink material conforms to irregular surfaces where rigid solutions often cannot make full contact.

At 2.5 mm thick, this variant is suitable for components with significant spacing between the chip and the heatsink. Common applications include voltage regulator modules, RAM chips, and solid-state drives. As the material is electrically non-conductive, there is no risk of short circuits when used near exposed motherboard traces. To install, simply place the material between the component and the cooler. The product is RoHS compliant, meeting environmental regulations regarding hazardous substances.

• Fills gaps in mounting tolerances for PC builds and industrial electronics
• Operating temperature range of -100 °C to 250 °C, suitable for extreme cooling
• Stable material that does not cure, ensuring long-term thermal contact
• Non-conductive properties prevent electrical hazards if the pad contacts traces
• Supplied as a single 30 x 30 mm pre-cut piece per pack