KLEVV FIT V 32GB (2 x 16GB) DDR5 6000 MHz, CL30 Memory, White (EXPO, XMP)
Key Specifications
Choose one or multiple features to search for items that have the same specifications.| Memory | |
| Registered | ![]() |
| Fully buffered memory | ![]() |
| Unbuffered memory | ![]() |
| Intel Extreme Memory Profile (XMP) | ![]() |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Weight & dimensions | |
| Weight | 50 g |
| Height | 33 mm |
| Width | 136.3 mm |
| Depth | 6 mm |
| Energy management | |
| Voltage | 1.35 V |
| Packaging data | |
| Package weight | 91 g |
| Package depth | 33 mm |
| Package height | 6 mm |
| Package width | 132 mm |
| Quantity per pack | 2 pc(s) |
| Other features | |
| Certification | UKCA |
| Form factor | UDIMM |
| Number of pins | 288 |
| Error indication | ![]() |
| Features | |
| Internal memory type | DDR5 |
| Memory type | DRAM |
| ECC | ![]() |
| Memory bus | 64 bit |
| Module configuration | 2048M x 64 |
| CAS latency | 30 |
| Product colour | White |
| Memory clock speed | 6000 MHz |
| Memory voltage | 1.35 V |
| SPD profile | ![]() |
| Memory form factor | 288-pin DIMM |
| Memory ranking | 2 |
| Component for | PC/Server |
| Internal memory | 32 GB |
| Memory layout (modules x size) | 2 x 16 GB |
| Intel Extreme Memory Profile (XMP) | ![]() |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| SPD speed | 4800 MHz |
| SPD voltage | 1.1 V |
| JEDEC standard | ![]() |
| Memory data transfer rate | 6000 MT/s |
| Buffered memory type | Unregistered (unbuffered) |
| On-Die ECC | ![]() |
| AMD Extended Profiles for Overclocking (EXPO) | ![]() |
| Sustainability | |
| Sustainability compliance | ![]() |
| Compliance certificates | UKCA |
| EAN | 4895194968160 |
The KLEVV FIT V 32 GB (2 × 16 GB) DDR5-6000 CL30 UDIMM Memory Kit – White is a matched desktop RAM kit for active system memory. Its two modules provide 32 GB of total capacity and transfer data at a rated 6000 MT/s. The DDR5 architecture and 288-pin DIMM format require a motherboard with compatible DDR5 UDIMM slots. The unbuffered modules are intended for PC and workstation systems rather than registered-memory platforms. Installed as a pair, the kit supports dual-channel operation on compatible Intel and AMD DDR5 platforms.
A CL30 CAS latency defines the primary access timing at the rated profile. Intel XMP 3.0 and AMD EXPO profiles provide preset configurations on platforms that support them. The profiled operating voltage is 1.35 V. Each stick uses an aluminium heat spreader for passive thermal management. At 33.2 mm tall, the low-profile modules provide clearance around large CPU coolers and in compact internal layouts. The heat spreaders have a white finish.
Key Features:- 4800 MHz SPD profile: 40-40-40-77 timings at 1.1 V
- JEDEC standard support: provides a defined baseline memory configuration
- Rank value 2: specifies the module's internal memory arrangement
- 2048M x 64 module configuration: details the organisation of each stick
- 64-bit memory bus: standard data width for a non-ECC UDIMM
- SK Hynix A-Die memory chips: identifies the installed DRAM die type
- On-die ECC: internal chip-level correction is included; system-level ECC is not supported
- Integrated PMIC and thermal sensor: provides onboard power management and temperature monitoring
Estimated delivery: 23.09 - 25.09
Today: 10:00 - 18:00
Estimated delivery: 23.09 - 25.09
Today: 09:00 - 17:00
Estimated delivery: 23.09 - 25.09
Today: 10:00 - 17:00
Estimated delivery: 23.09 - 25.09
Today: 10:00 - 18:00
Estimated delivery: 23.09 - 25.09
Today: 10:00 - 17:00
Estimated delivery time: 23.09 - 25.09
Estimated delivery time: 23.09 - 24.09
Estimated delivery time: 24.09 - 25.09
Estimated delivery time: 24.09 - 25.09
Estimated delivery time: 24.09
Estimated delivery time: 23.09 - 25.09
Estimated delivery time: 23.09 - 25.09
Estimated delivery time: 24.09


