KLEVV CRAS V RGB 32GB (2 x 16GB) DDR5 6000 MHz, CL30 Memory (EXPO, XMP)
Key Specifications
Choose one or multiple features to search for items that have the same specifications.| Memory | |
| Registered | ![]() |
| Fully buffered memory | ![]() |
| Unbuffered memory | ![]() |
| Intel Extreme Memory Profile (XMP) | ![]() |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Weight & dimensions | |
| Height | 44 mm |
| Width | 133.3 mm |
| Depth | 8 mm |
| Energy management | |
| Voltage | 1.35 V |
| Packaging data | |
| Package weight | 169 g |
| Package depth | 155 mm |
| Package height | 13 mm |
| Package width | 139 mm |
| Quantity per pack | 2 pc(s) |
| Other features | |
| Certification | UKCA |
| Number of pins | 288 |
| Error indication | ![]() |
| Features | |
| Internal memory type | DDR5 |
| ECC | ![]() |
| Module configuration | 2048M x 64 |
| CAS latency | 30 |
| Memory clock speed | 6000 MHz |
| Memory voltage | 1.35 V |
| SPD profile | ![]() |
| Memory form factor | 288-pin DIMM |
| Component for | PC/Server |
| Internal memory | 32 GB |
| Memory layout (modules x size) | 2 x 16 GB |
| SPD speed | 4800 MHz |
| SPD voltage | 1.1 V |
| Memory data transfer rate | 6000 MT/s |
| Buffered memory type | Unregistered (unbuffered) |
| On-Die ECC | ![]() |
| AMD Extended Profiles for Overclocking (EXPO) | ![]() |
| Sustainability | |
| Compliance certificates | UKCA |
| EAN | 4895194967224 |
The KLEVV CRAS V RGB Obsidian Black 32GB (2x16GB) DDR5-6000 CL30 Desktop Memory Kit is system RAM for compatible desktop PCs. Its two-module layout provides 32 GB of total memory for multitasking, gaming, and content-creation workloads. A rated data transfer rate of 6000 MT/s defines its primary performance specification. DDR5 technology means the kit requires a motherboard and processor platform that specifically supports this memory generation. Each module uses the standard 288-pin DIMM form factor and is intended for compatible Intel or AMD desktop systems.
CL30 CAS latency is the kit's main timing specification for latency-sensitive applications. Intel XMP 3.0 and AMD EXPO profiles allow supported motherboards to apply the rated settings through firmware. Those performance profiles operate at 1.35 V. An aluminium heatsink covers each module to help manage operating temperatures, while the 44 mm module height should be considered when checking CPU cooler clearance. Integrated RGB lighting is housed within the Obsidian Black design and provides customisable illumination in compatible builds.
Key Features:- On-die ECC: provides error correction within the memory chips but is not system-level ECC memory.
- Unbuffered architecture: uses conventional desktop memory rather than registered server memory.
- 4800 MHz SPD profile: includes a stored baseline configuration with 40-40-40-77 latency settings.
- 3000 MHz bus clock rate: corresponds to the underlying clock for the stated effective transfer rate.
- 2048M x 64 module configuration: specifies the internal organisation of each memory module.
- tRCD 36 and tRP 36: provide additional row-to-column and row-precharge timing values.
Estimated delivery: 23.09 - 25.09
Today: 10:00 - 18:00
Estimated delivery: 23.09 - 25.09
Today: 09:00 - 17:00
Estimated delivery: 23.09 - 25.09
Today: 10:00 - 17:00
Estimated delivery: 23.09 - 25.09
Today: 10:00 - 18:00
Estimated delivery: 23.09 - 25.09
Today: 10:00 - 17:00
Estimated delivery time: 23.09 - 25.09
Estimated delivery time: 23.09 - 24.09
Estimated delivery time: 24.09 - 25.09
Estimated delivery time: 24.09 - 25.09
Estimated delivery time: 24.09
Estimated delivery time: 23.09 - 25.09
Estimated delivery time: 23.09 - 25.09
Estimated delivery time: 24.09


