KLEVV CRAS V RGB 32GB (2 x 16GB) DDR5 6000 MHz, CL28 Memory (EXPO/XMP)
Key Specifications
Choose one or multiple features to search for items that have the same specifications.| Memory | |
| Registered | ![]() |
| Fully buffered memory | ![]() |
| Unbuffered memory | ![]() |
| Intel Extreme Memory Profile (XMP) | ![]() |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Weight & dimensions | |
| Weight | 50 g |
| Height | 33 mm |
| Width | 136.3 mm |
| Depth | 6 mm |
| Energy management | |
| Voltage | 1.35 V |
| Packaging data | |
| Package weight | 192 g |
| Package depth | 43 mm |
| Package height | 9 mm |
| Package width | 136 mm |
| Quantity per pack | 2 pc(s) |
| Other features | |
| Certification | UKCA |
| Form factor | UDIMM |
| Number of pins | 288 |
| Error indication | ![]() |
| Features | |
| Internal memory type | DDR5 |
| ECC | ![]() |
| Memory bus | 64 bit |
| Module configuration | 2048M x 64 |
| CAS latency | 28 |
| Memory clock speed | 6000 MHz |
| Memory voltage | 1.35 V |
| SPD profile | ![]() |
| Memory form factor | 288-pin DIMM |
| Memory channels | Dual-channel |
| Memory ranking | 2 |
| Component for | PC/Server |
| Internal memory | 32 GB |
| Memory layout (modules x size) | 2 x 16 GB |
| SPD speed | 4800 MHz |
| SPD voltage | 1.1 V |
| JEDEC standard | ![]() |
| Memory data transfer rate | 6000 MT/s |
| Buffered memory type | Unregistered (unbuffered) |
| On-Die ECC | ![]() |
| AMD Extended Profiles for Overclocking (EXPO) | ![]() |
| Sustainability | |
| Sustainability compliance | ![]() |
| Compliance certificates | UKCA |
| EAN | 4895194968931 |
The KLEVV CRAS V RGB memory kit is gaming and overclocking system memory for desktop builds. It supplies 32 GB through two 16 GB modules, providing capacity for multitasking and memory-intensive applications. A rated data transfer rate of 6000 MT/s defines its primary performance tier. DDR5 SDRAM and the 288-pin UDIMM form factor require a motherboard and processor that support this memory generation and module format. Compatibility covers Intel and AMD desktop platforms, along with compatible PC/server systems.
CAS latency is rated at CL28, reducing the delay before memory begins returning requested data. Intel XMP 3.0 and AMD EXPO profiles provide predefined performance settings on supported motherboards. The specified 1.35 V operating setting accompanies these profiles. An aluminium heatsink covers the modules to assist with heat dissipation under load. At 33 mm high, the modules have a relatively low profile for managing CPU cooler clearance. Integrated RGB lighting adds configurable illumination to the Obsidian Black design.
Key Features:- On-die ECC: detects and corrects errors within the DDR5 memory chips, but does not provide system-level ECC operation.
- Unbuffered and unregistered design: intended for platforms that accept standard consumer UDIMMs.
- JEDEC SPD profile: supports automatic operation at 4800 MHz and 1.1 V when an overclocking profile is not selected.
- 40-40-40-77 SPD timings: defines the default timing profile stored on the modules.
- 2048M x 64 module configuration: uses a 64-bit memory bus.
- Memory ranking value of 2: specifies the internal rank arrangement.
- Dual-channel configuration: the two-module kit can populate separate memory channels on a compatible motherboard.
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