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Formula 7 thermal compound

Manufacturer: ANTEC
ID: 0-761345-77061-3
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This product is end of life or currently not available.
Specifications
Description
Store availability
Delivery
Price development
Technical details
Thermal conductivity8.3 W/m·K
Weight & dimensions
Weight4 g
Operational conditions
Operating temperature (T-T)-50 - 250 °C
EAN761345770613
Warranty1 year
Source: Icecat.biz

Antec’s Formula 7 thermal compound protects your CPU even when your rig is running on all cylinders. Since little of the CPU’s surface actually touches the heat sink, you need a solution that isolates and facilitates the transfer of heat. Formula 7’s nano diamond particles minimize the distance between heat-conductive compounds and gladly take on an overclocking environment, optimally performing between -50°C and 250°C. To keep your system cool and your CPU functioning comfortably, pick up Antec’s Formula 7 for a diamond-caliber solution.

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The above technical details are for reference only and may change without notice. We reserve the right to correct printing errors and use illustrations for guidance. Some text may be auto-generated or machine-translated, which could lead to inaccuracies.

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