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Intel Xeon E3-1240V5 - 3.5 GHz - 4 ydintä - 8 säiettä - 8 Mt cache - LGA1151 Socket - Box
Manufacturer: INTEL
ID: BX80662E31240V5
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| Technical details | |
| Supported memory types | DDR4 |
| Product type | Processor |
| Processor cache | 8192 KB |
| Status | Discontinued |
| Maximum resolution & refresh rate (DisplayPort) | N/A |
| Maximum resolution & refresh rate (HDMI) | N/A |
| Maximum resolution & refresh rate (VGA) | N/A |
| Maximum resolution & refresh rate (Integrated Flat Panel) | N/A |
| Launch date | Q4'15 |
| Bus type units | GT/s |
| Bus bandwidth | 8 |
| Maximum memory | 64 GB |
| Processor brand name | Intel Xeon |
| Last change | 63903513 |
| Product family | Intel Xeon Processor E3 v5 Family |
| Maximum resolution (WiDi) | N/A |
| Bus speed | 8 GT/s |
| Processor | |
| Processor model | E3-1240V5 |
| Processor manufacturer | Intel |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon |
| Box | ![]() |
| Processor socket | LGA1151 |
| Stepping | R0 |
| Processor cores | 4 |
| Processor code | SR2LD |
| VID Voltage Range | 0.55 - 1.52 V |
| System bus rate | 8 GT/s |
| Processor threads | 8 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.9 GHz |
| Component for | Server/workstation |
| Processor cache | 8 MB |
| Bus type | DMI3 |
| Thermal Design Power (TDP) | 80 W |
| Processor codename | Skylake |
| Processor cache type | Smart Cache |
| Processor series | Intel Xeon E3-1200 v5 |
| Memory bandwidth supported by processor (max) | 34.1 GB/s |
| Processor ARK ID | 88176 |
| Cooler included | ![]() |
| Processor base frequency | 3.5 GHz |
| Memory | |
| ECC | ![]() |
| Memory channels | Dual-channel |
| Maximum internal memory supported by processor | 64 GB |
| Memory types supported by processor | DDR4-SDRAM, DDR3L-SDRAM |
| Memory clock speeds supported by processor | 1333,1600,1866,2133 MHz |
| Memory voltage supported by processor | 1.35 V |
| Weight & dimensions | |
| Processor package size | 37.5 x 37.5 mm |
| Packaging data | |
| Package weight | 373 g |
| Package depth | 116 mm |
| Package height | 101 mm |
| Package width | 70 mm |
| Package type | Box |
| Other features | |
| Maximum internal memory | 64 GB |
| Graphics output | N/A |
| Graphics | |
| On-board graphics card 4K support | ![]() |
| Processor special features | |
| Intel® Rapid Start Technology | ![]() |
| Intel® Smart Response Technology | ![]() |
| Intel Smart Connect Technology | ![]() |
| Intel® Hyper Threading Technology (Intel® HT Technology) | ![]() |
| Intel® Turbo Boost Technology | 2.0 |
| Intel® Quick Sync Video Technology | ![]() |
| Intel® InTru™ 3D Technology | ![]() |
| Intel® Wireless Display (Intel® WiDi) | ![]() |
| Intel® Clear Video HD Technology (Intel® CVT HD) | ![]() |
| Intel® Insider™ | ![]() |
| Intel® Smart Cache | ![]() |
| Intel® AES New Instructions (Intel® AES-NI) | ![]() |
| Enhanced Intel SpeedStep Technology | ![]() |
| Intel Trusted Execution Technology | ![]() |
| Intel® Active Management Technology (Intel® AMT) | ![]() |
| Intel® Matrix Storage Technology (Intel® MST) | ![]() |
| Intel Enhanced Halt State | ![]() |
| Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID) | ![]() |
| Intel VT-x with Extended Page Tables (EPT) | ![]() |
| Intel® High Definition Audio (Intel® HD Audio) | ![]() |
| Intel® Small Business Advantage (Intel® SBA) | ![]() |
| Intel TSX-NI | ![]() |
| Intel® Secure Key | ![]() |
| Intel 64 | ![]() |
| Intel® OS Guard | ![]() |
| Intel Virtualization Technology for Directed I/O (VT-d) | ![]() |
| Intel® Built-in Visuals Technology | ![]() |
| Intel Clear Video Technology | ![]() |
| Intel Software Guard Extensions (Intel SGX) | ![]() |
| Intel HD Graphics | ![]() |
| Intel Secure Key Technology version | 1.00 |
| Intel Virtualization Technology (VT-x) | ![]() |
| Intel TSX-NI version | 1.00 |
| Conflict-Free processor | ![]() |
| Intel® Memory Protection Extensions (Intel® MPX) | ![]() |
![]() | |
| Intel® vPro™ Platform Eligibility | ![]() |
| Intel® Transactional Synchronization Extensions | ![]() |
| Intel® Turbo Boost Technology 2.0 frequency | 3.9 GHz |
| Features | |
| Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
| PCI Express slots version | 3.0 |
| Execute Disable Bit | ![]() |
| Idle States | ![]() |
| Thermal Monitoring Technologies | ![]() |
| Scalability | 1S |
| CPU configuration (max) | 1 |
| Embedded options available | ![]() |
| Graphics & IMC lithography | 14 nm |
| PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
| Maximum number of PCI Express lanes | 16 |
| Market segment | Server |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G077159 |
| PCI Express CEM revision | 3.0 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| EAN | 5032037076920 |
| Warranty | 1 year |
ECC Memory Supported
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Intel® vPro Technology
Intel® vPro™ Technology is a set of security and manageability capabilities built into the processor aimed at addressing four critical areas of IT security: 1) Threat management, including protection from rootkits, viruses, and malware 2) Identity and web site access point protection 3) Confidential personal and business data protection 4) Remote and local monitoring, remediation, and repair of PCs and workstations.
Intel® Hyper-Threading Technology
Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Intel® vPro Technology
Intel® vPro™ Technology is a set of security and manageability capabilities built into the processor aimed at addressing four critical areas of IT security: 1) Threat management, including protection from rootkits, viruses, and malware 2) Identity and web site access point protection 3) Confidential personal and business data protection 4) Remote and local monitoring, remediation, and repair of PCs and workstations.
Intel® Hyper-Threading Technology
Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits
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The above technical details are for reference only and may change without notice. We reserve the right to correct printing errors and use illustrations for guidance. Some text may be auto-generated or machine-translated, which could lead to inaccuracies.


