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Supermicro X10SDV-8C-TLN4F Mini-ITX - motherboard

Manufacturer: SUPERMICRO
ID: MBD-X10SDV-8C-TLN4F-O
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Key Specifications

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Specifications
Description
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Processor
Processor manufacturerIntel
Processor socketBGA 1667
Processor number of cores supported8
Processor thermal power (max)45 W
Maximum number of PCI Express lanes48
Memory
Maximum internal memory128 GB
ECCcheckmark
Non-ECCcheckmark
Memory voltage1.2 V
Supported memory clock speeds1600,1866,2133 MHz
Supported memory typesDDR4
Maximum RDIMM memory128 GB
Weight & dimensions
Width170 mm
Depth170 mm
Operational conditions
Operating temperature (T-T)0 - 60 °C
Networking
Ethernet LANcheckmark
Wi-Ficross
Ethernet interface type10 Gigabit Ethernet, Fast Ethernet, Gigabit Ethernet
Internal I/O
USB 2.0 connectors4
Number of COM connectors1
Chassis intrusion connectorcheckmark
Number of SATA III connectors6
Back panel I/O ports
Ethernet LAN (RJ-45) ports4
VGA (D-Sub) ports quantity1
IPMI LAN (RJ-45) portcheckmark
USB 3.0 (3.1 Gen 1) Type-A ports quantity2
Storage controllers
Supported storage drive interfacesSATA III
Expansion slots
PCI Express x16 (Gen 3.x) slots1
BIOS
BIOS memory size16 Mbit
BIOS typeAMI
ACPI version4.0
Other features
Number of DIMM slots4
Supported DIMM module capacities4GB, 8GB, 16GB, 32GB
Maximum UDIMM memory64 GB
Number of processors supported1
Graphics
On-board graphics card modelAspeed AST2400
Processor special features
Intel Rapid Storage Technologycheckmark
Intel Virtualization Technology for Directed I/O (VT-d)checkmark
Intel Clear Video Technologycheckmark
Connector for Intel I/O Expansion Module x4 Gen 18
Connector for Intel I/O Expansion Module x4 Gen 26
Connector for Intel I/O Expansion Module x8 Gen 312
Features
Motherboard form factorMini ITX
Component forServer
Physical Address Extension (PAE)24 bit
EAN672042194605
Warranty1 year
Source: Icecat.biz

Supermicro leverages its deep expertise in server technology to bring customers the first Intel® Xeon® System-on a-Chip (SoC) D-1500 Family solutions. The X10SDV series offer infrastructure optimization, by combining the performance and advanced intelligence of Intel® Xeon® processors into a dense, lower-power system-on-a-chip. With server-class reliability, availability and serviceability (RAS) features now available in an ultra-dense, low-power device, the X10SDV will be able to deliver balanced compute, storage and intelligent edge networks and appliances. These advanced technology building blocks offer the best work load optimized solutions and long life availability with the Intel® Xeon® processor D family, with up to 128GB DDR4 ECC RDIMM operating at 2133MHz, USB 3.0 I/O, six SATA3.0 storage and dual 10 GbE LAN networking ports.

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