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TS/Thermal Solution STS300C BOX

Manufacturer: INTEL
ID: BXSTS300C
Product unavailable
This product is end of life or currently not available.
Specifications
Description
Store availability
Delivery
Price development
Weight & dimensions
Height64 mm
Width91 mm
Depth88 mm
Energy management
Thermal Design Power (TDP)280 W
Packaging content
Package typeBox
Other features
Country of originChina
Performance
TypeHeatsink/Radiatior
Compatible processor seriesIntel® Xeon®
Compatible productsLGA3647 socket
Supported processor socketsLGA 3647 (Socket P)
Suitable locationProcessor
ARK ID126284
EAN5032037101165
Warranty1 year
Source: Icecat.biz
Unfortunately we don't have any product information for this product.

No price development information for this product.

Multitronic Vaasa: 0 pcs
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Multitronic Pietarsaari: 0 pcs
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Multitronic Jyväskylä: 0 pcs
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Multitronic Lappeenranta: 0 pcs
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Multitronic Mariehamn: 0 pcs
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The above technical details are for reference only and may change without notice. We reserve the right to correct printing errors and use illustrations for guidance. Some text may be auto-generated or machine-translated, which could lead to inaccuracies.

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