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Intel Xeon E3-1265LV3 - 2.5 GHz - 4 ydintä - 8 säiettä - 8 Mt cache - LGA1150 Socket - OEM
Manufacturer: INTEL
ID: CM8064601467406
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| Technical details | |
| Product type | Processor |
| Processor cache | 8192 KB |
| Status | Launched |
| Launch date | Q2'13 |
| Product name | Intel Xeon E3-1265L v3 (8M Cache, 2.50 GHz) |
| Number of graphics cores | 10 |
| Born on date | Q2'13 |
| Graphics max dynamic frequency | 1.20 GHz |
| Bus type units | GT/s |
| Bus bandwidth | 5 |
| Maximum memory | 32 GB |
| Processor brand name | Intel Xeon v2 |
| Last change | 63903513 |
| Product family | Intel Xeon Processor E3 v3 Family |
| Processor | |
| Processor model | E3-1265LV3 |
| Processor lithography | 22 nm |
| Processor family | Intel Xeon |
| Box | ![]() |
| Processor socket | LGA 1150 |
| Stepping | C0 |
| Processor cores | 4 |
| Processor code | SR15A |
| L3 cache speed | 2.5 GHz |
| System bus rate | 5 GT/s |
| Processor threads | 8 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.7 GHz |
| Component for | Server/Workstation |
| Processor cache | 8 MB |
| Bus type | DMI |
| Processor frequency | 2.5 GHz |
| Processor codename | Haswell |
| Processor cache type | Smart Cache |
| Processor series | Intel Xeon E3-1200 v3 |
| Memory bandwidth supported by processor (max) | 25.6 GB/s |
| Processor ARK ID | 75463 |
| Memory | |
| ECC | ![]() |
| Memory channels | Dual |
| Maximum internal memory supported by processor | 32 GB |
| Memory types supported by processor | DDR3-SDRAM |
| Memory clock speeds supported by processor | 1333,1600 MHz |
| Weight & dimensions | |
| Processor package size | 37.5 x 37.5 mm |
| Energy management | |
| Thermal Design Power (TDP) | 45 W |
| Other features | |
| Maximum internal memory | 32768 MB |
| Intel® Virtualization Technology (Intel® VT) | VT-d,VT-x |
| Cache memory | 8 MB |
| Graphics | |
| On-board graphics card model | ![]() |
| On-board graphics card | ![]() |
| On-board graphics card base frequency | 350 MHz |
| On-board graphics card dynamic frequency (max) | 1200 MHz |
| Number of displays supported (on-board graphics) | 3 |
| Processor special features | |
| Intel® Identity Protection Technology (Intel® IPT) | ![]() |
| Intel® Anti-Theft Technology (Intel® AT) | ![]() |
| Intel® vPro™ Technology | ![]() |
| Intel® Hyper Threading Technology (Intel® HT Technology) | ![]() |
| Intel® Turbo Boost Technology | 2.0 |
| Intel® Quick Sync Video Technology | ![]() |
| Intel® InTru™ 3D Technology | ![]() |
| Intel FDI Technology | ![]() |
| Intel® Clear Video HD Technology (Intel® CVT HD) | ![]() |
| Intel Dual Display Capable Technology | ![]() |
| Intel Fast Memory Access | ![]() |
| Intel Flex Memory Access | ![]() |
| Intel® Smart Cache | ![]() |
| Intel® AES New Instructions (Intel® AES-NI) | ![]() |
| Enhanced Intel SpeedStep Technology | ![]() |
| Intel Trusted Execution Technology | ![]() |
| Intel Enhanced Halt State | ![]() |
| Intel VT-x with Extended Page Tables (EPT) | ![]() |
| Intel TSX-NI | ![]() |
| Intel® Secure Key | ![]() |
| Intel 64 | ![]() |
| Intel Stable Image Platform Program (SIPP) | ![]() |
| Intel® OS Guard | ![]() |
| Intel Virtualization Technology for Directed I/O (VT-d) | ![]() |
| Intel Identity Protection Technology version | 1.00 |
| Intel Secure Key Technology version | 1.00 |
| Intel Virtualization Technology (VT-x) | ![]() |
| Intel Stable Image Platform Program (SIPP) version | 1.00 |
| Intel TSX-NI version | 1.00 |
| Conflict-Free processor | ![]() |
| Features | |
| Bandwidth | 5 MB/s |
| Supported instruction sets | AVX 2.0,SSE4.1,SSE4.2 |
| PCI Express slots version | 3.0 |
| Execute Disable Bit | ![]() |
| Idle States | ![]() |
| Thermal Monitoring Technologies | ![]() |
| Scalability | 1S |
| CPU configuration (max) | 1 |
| Embedded options available | ![]() |
| Graphics & IMC lithography | 22 nm |
| PCI Express configurations | 1x16,2x8,1x8+2x4 |
| Thermal solution specification | PCG 2013B |
| Maximum number of PCI Express lanes | 16 |
| Market segment | SRV |
| EAN | 0675901217989 |
| Source: Icecat.biz | |
Intel® Turbo Boost Technology
Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.
Hyper-Threading Technology (HT Technology)
Today's Intel® Hyper-Threading Technology (Intel® HT Technology) delivers thread-level parallelism on each processor resulting in more efficient use of processor resources—higher processing throughput—and improved performance on the multi-threaded software of today and tomorrow.
Intel® Anti-Theft Technology
Intel® Anti-Theft Technology (Intel® AT) helps keep your laptop safe and secure in the event that it’s ever lost or stolen. Intel® AT requires a service subscription from an Intel® AT–enabled service provider.
Idle States
Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Intel® Fast Memory Access
Intel® Fast Memory Access is an updated Graphics Memory Controller Hub (GMCH) backbone architecture that improves system performance by optimizing the use of available memory bandwidth and reducing the latency of the memory accesses.
Intel® Flex Memory Access
Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.
Execute Disable Bit
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.
Intel® VT-x with Extended Page Tables (EPT)
Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.
Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.
Hyper-Threading Technology (HT Technology)
Today's Intel® Hyper-Threading Technology (Intel® HT Technology) delivers thread-level parallelism on each processor resulting in more efficient use of processor resources—higher processing throughput—and improved performance on the multi-threaded software of today and tomorrow.
Intel® Anti-Theft Technology
Intel® Anti-Theft Technology (Intel® AT) helps keep your laptop safe and secure in the event that it’s ever lost or stolen. Intel® AT requires a service subscription from an Intel® AT–enabled service provider.
Idle States
Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Intel® Fast Memory Access
Intel® Fast Memory Access is an updated Graphics Memory Controller Hub (GMCH) backbone architecture that improves system performance by optimizing the use of available memory bandwidth and reducing the latency of the memory accesses.
Intel® Flex Memory Access
Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.
Execute Disable Bit
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.
Intel® VT-x with Extended Page Tables (EPT)
Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.
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The above technical details are for reference only and may change without notice. We reserve the right to correct printing errors and use illustrations for guidance. Some text may be auto-generated or machine-translated, which could lead to inaccuracies.


