Key Specifications
Choose one or multiple features to search for items that have the same specifications.| Memory | |
| Memory form factor | 288-pin DIMM |
| Memory layout (modules x size) | 1 x 8 GB |
| Intel Extreme Memory Profile (XMP) | ![]() |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Weight & dimensions | |
| Weight | 33.57 g |
| Height | 34.1 mm |
| Width | 7.2 mm |
| Depth | 133.3 mm |
| Length | 133.35 mm |
| Operational conditions | |
| Storage temperature (T-T) | -55 - 100 °C |
| Operating temperature (T-T) | 0 - 85 °C |
| Packaging data | |
| Package weight | 51.58 g |
| Package depth | 14 mm |
| Package height | 171.4 mm |
| Package width | 57.1 mm |
| Other features | |
| Number of pins | 288 |
| Features | |
| Internal memory type | DDR4 |
| ECC | ![]() |
| Module configuration | 1024M x 64 |
| Lead plating | Gold |
| CAS latency | 17 |
| Product colour | Black |
| Memory clock speed | 3600 MHz |
| Country of origin | China, Taiwan |
| Backlight | ![]() |
| Memory voltage | 1.35 V |
| Cooling type | Passive |
| RoHS compliance | ![]() |
| Memory ranking | 1 |
| Component for | PC |
| Internal memory | 8 GB |
| Memory layout (modules x size) | 1 x 8 GB |
| Memory data transfer rate | 3600 MT/s |
| Buffered memory type | Unregistered (unbuffered) |
| AMD Extended Profiles for Overclocking (EXPO) | ![]() |
| Logistics data | |
| Master (outer) case height | 61 mm |
| Master (outer) case width | 196.8 mm |
| Master (outer) case gross weight | 1.43 kg |
| Master (outer) case length | 311.1 mm |
| Products per master (outer) case | 25 pc(s) |
| Shipping (inner) case width | 19.7 cm |
| Shipping (inner) case length | 31.1 cm |
| Shipping (inner) case height | 6.1 cm |
| Products per shipping (inner) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| EAN | 0740617319798 |
| Warranty | 5 years |
The Kingston KF436C17BB/8 is a single 8GB DDR4 memory module engineered for desktop PC upgrades. Operating at a frequency of 3600MHz with a CAS latency of 17, it delivers balanced performance for improved system responsiveness in multitasking and application loading. This module is designed for stability across various computing workloads, from everyday tasks to more demanding applications. It supports both Intel XMP 2.0 and is AMD Ryzen Ready, allowing for simplified performance tuning within the system BIOS on compatible motherboards.
This unbuffered, non-ECC module is constructed to standard JEDEC specifications for broad system compatibility. It features a low-profile heat spreader finished in black, which provides passive cooling to maintain optimal operating temperatures. Measuring 34.1 mm in height, its compact design ensures clearance for large CPU air coolers in a variety of system builds. The module's construction focuses on reliable performance and effective thermal management without the inclusion of RGB lighting or other aesthetic embellishments.
Key Features:- Provides 8 GB of DDR4 memory in a single module configuration
- Operates at a clock speed of 3600 MHz
- Features a CAS latency of 17
- Requires a voltage of 1.35 V
- Utilizes a 288-pin DIMM form factor
- Compatible with Intel XMP 2.0 and AMD Ryzen platforms
- Equipped with a low-profile black heat spreader for cooling
- Measures 34.1 mm in height for compatibility with most CPU coolers
Estimated delivery: 15.12
Today: Closed (Independence Day)
Estimated delivery: 15.12
Today: Closed
Estimated delivery: 15.12
Today: Closed
Estimated delivery: 15.12
Today: Closed
Estimated delivery: 15.12
Today: Closed (Independence Day)
Estimated delivery time: 15.12
Estimated delivery time: 16.12
Estimated delivery time: 15.12
Estimated delivery time: 16.12
Estimated delivery time: 16.12
Estimated delivery time: 15.12
Estimated delivery time: 15.12
Estimated delivery time: 16.12
- leaflet (English)


