Key Specifications
Choose one or multiple features to search for items that have the same specifications.| Weight & dimensions | |
| Weight | 746 g |
| Package weight | 894 g |
| Cable length | 0.2 m |
| Height | 158.5 mm |
| Width | 133 mm |
| Depth | 91 mm |
| Package depth | 113 mm |
| Package height | 168 mm |
| Package width | 144 mm |
| Heat pipes diameter | 6 mm |
| Fan dimensions (W x D x H) | 133 x 91 x 135 mm |
| Fins thickness | 0.4 mm |
| Energy management | |
| Rated current | 0.12 A |
| Voltage | 12 V |
| Fan voltage | 12 V |
| Rated voltage | 12 V |
| LED voltage | 12 V |
| Packaging content | |
| Remote control included | ![]() |
| Package type | Box |
| Mounting kit | ![]() |
| CPU bracket(s) | ![]() |
| Other features | |
| Country of origin | China |
| Current | 0.12 A |
| Number of fans supported | 1 |
| Design | |
| Material | Aluminium |
| Product colour | Black |
| Number of fans | 1 fan(s) |
| Illumination colour | Multi |
| Fan connector | 4-pin |
| Number of heat pipes | 4 |
| Illumination LED | ![]() |
| Number of LEDs | 12 |
| Number of fins | 54 |
| Fins material | Aluminium |
| Performance | |
| Type | Cooler |
| Operating temperature (T-T) | 0 - 40 °C |
| Fan diameter | 12 cm |
| Supported processor sockets | LGA 1150 (Socket H3), LGA 1151 (Socket H4), LGA 1155 (Socket H2), LGA 1200 (Socket H5), LGA 1700 |
| Suitable location | Processor |
| Maximum airflow | 100 cfm |
| Fan speed (max) | 1700 RPM |
| Fan speed (min) | 200 RPM |
| Rotational speed (max) | 1700 RPM |
| Rotational speed (min) | 200 RPM |
| Bearing type | Fluid Dynamic Bearing (FDB) |
| Quantity per pack | 1 pc(s) |
| Fan noise level (max) | 23 dB |
| Pulse-width modulation (PWM) support | ![]() |
| Noise level | 0.35 sone |
| Logistics data | |
| Harmonized System (HS) code | 84733080 |
| EAN | 4895213703444 |
| Warranty | 1 year |
The ARCTIC Freezer i35 is an air-based CPU cooling solution designed for compatibility with current Intel platforms, including LGA 1700, 1200, 1151, 1150, and 1155 sockets. Heat is transferred efficiently from the processor via four direct-touch 6 mm copper heat pipes, which distribute thermal energy across 54 optimized aluminum fins. This tower configuration measures 158.5 mm in height, 133 mm in width, and 91 mm in depth, requiring adequate vertical clearance within the chassis. The heatsink assembly employs a single pre-mounted 120 mm cooling fan optimized for consistent static pressure and thermal throughput.
The integrated 120 mm fan features a Fluid Dynamic Bearing (FDB) design, contributing to reduced friction and extended operational lifespan. Fan speed is dynamically regulated using Pulse Width Modulation (PWM), allowing rotational speeds to range from a minimum of 200 RPM up to 1700 RPM. At peak operating speed, the unit achieves a maximum airflow rating of 100 CFM while generating an acoustic output measured at 0.35 sone. The cooler incorporates multi-color Addressable RGB (ARGB) illumination provided by 12 integrated LEDs, connecting via a standard 3-pin ARGB header for software synchronization.
Key Features:- Supported sockets include LGA 1150, 1151, 1155, 1200, and 1700
- Four 6 mm copper heat pipes
- Single 120 mm cooling fan included
- Fluid Dynamic Bearing (FDB) fan technology
- Fan speed controlled via PWM (200 RPM minimum)
- Maximum rotational speed of 1700 RPM
- Maximum airflow rating of 100 CFM
- Addressable RGB (ARGB) multi-color illumination
- Overall dimensions of 158.5 mm high, 133 mm wide, and 91 mm deep
- Total weight of 746 g
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- leaflet (English)


