Kingston FURY Renegade Pro 256GB (8 x 32GB) DDR5 7200 MHz, CL38 Memory (XMP & EXPO)
Key Specifications
Choose one or multiple features to search for items that have the same specifications.| Memory | |
| Intel Extreme Memory Profile (XMP) | ![]() |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Weight & dimensions | |
| Weight | 283.6 g |
| Height | 34.1 mm |
| Width | 7.31 mm |
| Depth | 133.3 mm |
| Operational conditions | |
| Storage temperature (T-T) | -55 - 100 °C |
| Operating temperature (T-T) | 0 - 95 °C |
| Packaging data | |
| Package weight | 404.71 g |
| Package depth | 57.1 mm |
| Package height | 174 mm |
| Package width | 97.8 mm |
| Other features | |
| Number of pins | 288 |
| Country of origin | China, Taiwan |
| Doesn't contain | Halogen |
| Features | |
| Internal memory type | DDR5 |
| ECC | ![]() |
| Lead plating | Gold |
| CAS latency | 38 |
| Product colour | Black |
| Memory clock speed | 3600 MHz |
| Memory voltage | 1.4 V |
| Cooling type | Passive |
| SPD profile | ![]() |
| Memory form factor | 288-pin DIMM |
| Component for | PC/Server |
| Internal memory | 256 GB |
| Product type | Random-access memory |
| Memory layout (modules x size) | 8 x 32 GB |
| Memory data transfer rate | 7200 MT/s |
| Buffered memory type | Registered (buffered) |
| On-Die ECC | ![]() |
| AMD Extended Profiles for Overclocking (EXPO) | ![]() |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
| Logistics data | |
| Master (outer) case height | 158.8 mm |
| Master (outer) case width | 215.9 mm |
| Master (outer) case gross weight | 2.28 kg |
| Master (outer) case length | 361.9 mm |
| Products per master (outer) case | 5 pc(s) |
| Sustainability | |
| Compliance certificates | RoHS |
| EAN | 0740617354904 |
| Warranty | 30 years |
The Kingston FURY Renegade Pro memory kit is built for workstation and server platforms requiring continuous data processing. Featuring an Error Correction Code (ECC) architecture, it detects and corrects single-bit memory errors to maintain data integrity during compute-heavy tasks. The registered design buffers control signals, enabling stable, high-capacity configurations across multiple modules. This kit targets environments handling professional content creation, engineering simulations, and complex calculations.
For performance tuning, the memory supports Intel XMP 3.0 and AMD EXPO 1.1 profiles to apply predefined settings on compatible systems. A built-in passive aluminum heat spreader manages thermals by dissipating heat during sustained operations. This kit provides a hardware solution for builders populating multi-channel, high-end desktop layouts.
Key Features:- Total capacity of 256 gigabytes via eight 32-gigabyte modules
- DDR5 internal memory type
- Data transfer rate of 7200 MT/s
- CAS latency of 38 at 1.4 volts
- 288-pin DIMM form factor
- Configured for octal-channel memory architecture
- Black exterior without RGB lighting
- Measures 133.35 millimeters in length and 34.12 millimeters in height
- Total weight of 283.6 grams
Estimated delivery: 30.04 - 03.05
Today: 10:00 - 18:00
Estimated delivery: 30.04 - 03.05
Today: 09:00 - 17:00
Estimated delivery: 30.04 - 03.05
Today: 10:00 - 17:00
Estimated delivery: 30.04 - 03.05
Today: 10:00 - 18:00
Estimated delivery: 30.04 - 03.05
Today: 10:00 - 17:00
Estimated delivery time: 30.04 - 03.05
Estimated delivery time: 30.04 - 02.05
Estimated delivery time: 01.05 - 03.05
Estimated delivery time: 01.05 - 03.05
Estimated delivery time: 01.05 - 02.05
Estimated delivery time: 30.04 - 03.05
Estimated delivery time: 30.04 - 03.05
Estimated delivery time: 01.05 - 02.05

