Key Specifications
Choose one or multiple features to search for items that have the same specifications.| Technical details | |
| Non-curing | ![]() |
| Non-corrosive | ![]() |
| Weight & dimensions | |
| Weight | 2 g |
| Packaging data | |
| Quantity per pack | 1 pc(s) |
| Degreaser included | ![]() |
| Packaging content | |
| Mounting kit | ![]() |
| Screws included | ![]() |
| Other features | |
| Thermal grease | ![]() |
| Features | |
| Compatibility | General-purpose CPU/GPU cooling |
| Compatible products | Water cooling systems |
| Thermal resistance | 0 °C/W |
| Easy to install | ![]() |
| Thermal conductivity | 11.8 W/m·K |
| Supported processor sockets | Universal |
| Suitable for | Medium- to large-scale cooling solutions, water cooling systems, and overclocking |
| Easy to use | ![]() |
| Product type | Thermal grease |
| Constitutive ingredients | Silicon-free |
| Best uses | Overclocking and water cooling systems |
| Non-conductive | ![]() |
| Density | 2.6 g/cm³ |
| EAN | 4260711992926 |
Thermal Grizzly Hydronaut Pro (2 g) is a thermal compound designed to transfer heat between processors and cooling systems. With a thermal conductivity of 11.8 W/m·K, it helps dissipate heat from integrated circuits by filling microscopic air gaps between the heat spreader and the cooler base. This compound is well-suited for water-cooling systems and overclocking. It can be applied to both CPU and GPU surfaces to maintain stable temperatures under load.
The compound is non-conductive and non-corrosive, protecting electrical components from short circuits and preventing metal degradation. Its non-curing formula maintains consistent thermal contact without needing a settling period. The silicon-free composition ensures long-term stability. It is applied using a syringe for precise placement and remains pliable, making maintenance and reapplication easier when hardware is upgraded or cleaned.
Key Features:- 2 g provides enough material for multiple standard processor applications.
- Density of 2.6 g/cm³ allows the grease to spread evenly under mounting pressure.
- Compatible with all current Intel and AMD processor sockets.
- Includes one syringe of thermal grease for immediate use.
- Optimized for medium- to large-scale cooling solutions.
- Includes only the thermal interface material; no degreaser or mounting kit is supplied.
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