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|Processor front side bus||1066 MHz|
|Processor lithography||45 nm|
|Processor family||Intel Core 2 Duo|
|L2 cache speed||2.0|
|Processor operating modes||64-bit|
|Processor cache||3 MB|
|Processor frequency||2 GHz|
|Processor cache type||L2|
|VID Voltage Range||1.00 - 1.25 V|
|Intel® Virtualization Technology (Intel® VT)||VT-x|
|Processor special features|
|Enhanced Intel SpeedStep Technology|
|Intel Virtualization Technology (VT-x)|
|Execute Disable Bit|
|Number of Processing Die Transistors||410 M|
|Processing Die size||107 mm²|
|Graphics & IMC lithography||45 nm|
|Thermal Design Power (TDP)||25 W|
|Processor package size||35|
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
VID Voltage Range
VID Voltage Range is an indicator of the minimum and maximum voltage values at which the processor is designed to operate. The processor communicates VID to the VRM (Voltage Regulator Module), which in turn delivers that correct voltage to the processor.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.