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Flex x220 E5-2403 4C 4GB

Manufacturer: IBM
ID: 7906C2G
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This product is end of life or currently not available.
Specifications
Description
Store availability
Delivery
Price development
Processor
Processor modelE5-2403
Motherboard chipsetIntel C600
Number of processors installed1
Processor lithography32 nm
Maximum number of SMP processors2
Processor familyIntel® Xeon® E5 Family
Processor socketLGA 1356
SteppingM1
Supported instruction setsAVX
Processor cores4
Processor codeSR0LS
System bus rate6.4 GT/s
Processor threads4
Processor operating modes64-bit
Processor cache10 MB
Execute Disable Bitcheckmark
Idle Statescheckmark
Thermal Monitoring Technologiescheckmark
Scalability2S
FSB Paritycross
Embedded options availablecross
Bus typeQPI
Number of QPI links1
Processor frequency1.8 GHz
Thermal Design Power (TDP)80 W
Processor codenameSandy Bridge EN
Maximum number of PCI Express lanes24
Processor cache typeSmart Cache
Processor seriesIntel Xeon E5-2400
Maximum internal memory supported by processor375 GB
Memory types supported by processorDDR3-SDRAM
Memory clock speeds supported by processor800,1066 MHz
Memory bandwidth supported by processor (max)25 GB/s
Memory channels supported by processorTriple
ECC supported by processorcheckmark
Processor package size45 mm
Conflict-Free processorcross
Memory
Internal memory typeDDR3-SDRAM
Memory slots12
Maximum internal memory384 GB
ECCcheckmark
Memory clock speed1066 MHz
Memory layout (slots x size)1 x 4 GB
Internal memory4 GB
Ports & interfaces
Serial ports quantity1
USB 2.0 ports quantity1
Ethernet LAN (RJ-45) ports2
Weight & dimensions
Weight6.4 kg
Height492 mm
Width217 mm
Depth56 mm
Energy management
Redundant power supply (RPS) supportcheckmark
Operational conditions
Operating altitude0 - 3048 m
Operating relative humidity (H-H)8 - 85%
Storage temperature (T-T)1 - 60 °C
Operating temperature (T-T)5 - 40 °C
Storage relative humidity (H-H)5 - 100%
Non-operating altitude0 - 10700 m
Networking
Cabling technology10/100/1000Base-T(X)
Ethernet LANcheckmark
Wake-on-LAN readycheckmark
Ethernet interface typeGigabit Ethernet
Storage
HDD interfaceSATA
RAID levels0, 1
HDD size2.5"
Number of HDDs supported2
Hot-swapcheckmark
SSD interfaceSerial ATA, Serial ATA II, Serial ATA III, Serial Attached SCSI
Maximum storage capacity2 TB
S.M.A.R.T. supportcheckmark
Supported HDD sizes2.5"
RAID supportcheckmark
Number of SSDs supported2
Packaging data
Package weight8 kg
Package depth603 mm
Package height197 mm
Package width430 mm
Certificates
CertificationASHRAE Class A3
FCC Part 15 Class A
Canada ICES-004, Issue 3 Class A
UL/IEC 60950-1
CSA C22.2 No.60950-1
NOM-019
Argentina IEC60950-1
Japan VCCI, Class A
IEC60950-1 (CB Certificate, CB Test Report)
China CCC (GB4943); (GB9254, Class A); (GB17625.1)
Taiwan BSMI CNS13438, Class A; CNS14336
Australia/New Zealand AS/NZS CISPR22, Class A
Korea KN22, Class A, KN24
Russia/GOST ME01, IEC 60950-1, GOST R51318.22, GOST R 51318.249, GOST R 51317.3.2, GOST R 51317.3.3
IEC 60950-1 (CB Certificate, CB Test Report)
CE Mark (EN55022 Class A, EN60950-1, EN55024, EN61000-3-2, EN61000-3-3) CISPR22, Class A
TUV-GS (EN60950-1/IEC60950-1, EK1-ITB2000)
Operating system/software
Compatible operating systemsWindows Server 2008 R2
Red Hat Enterprise Linux 5/ 6
SUSE Linux Enterprise Server 10/ 11
VMware ESX 4.1/ 5
Operating system installedcross
Expansion slots
PCI Express x8 slots2
PCI Express slots version3.0
Other features
Graphics cardG200eR2
Graphics card familyMatrox
Intel® Virtualization Technology (Intel® VT)VT-d,VT-x
Design
Rack mountingcheckmark
Chassis typeBlade
Optical drive typeN
Redundant fans supportcheckmark
Graphics
Maximum graphics card memory16 MB
Processor special features
Intel® My WiFi Technology (Intel® MWT)cross
Intel® Anti-Theft Technology (Intel® AT)cross
Intel® vPro™ Technologycheckmark
Intel® Hyper Threading Technology (Intel® HT Technology)cross
Intel® Turbo Boost Technologycross
Intel® Quick Sync Video Technologycross
Intel® InTru™ 3D Technologycross
Intel® Wireless Display (Intel® WiDi)cross
Intel FDI Technologycross
Intel® Clear Video HD Technology (Intel® CVT HD)cross
Intel Dual Display Capable Technologycross
Intel® Insider™cross
Intel Fast Memory Accesscross
Intel Flex Memory Accesscheckmark
Intel® Smart Cachecheckmark
Intel® AES New Instructions (Intel® AES-NI)checkmark
Enhanced Intel SpeedStep Technologycheckmark
Intel Trusted Execution Technologycheckmark
CPU configuration (max)2
Intel Enhanced Halt Statecheckmark
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID)cross
Intel VT-x with Extended Page Tables (EPT)checkmark
Intel Demand Based Switchingcheckmark
Intel Rapid Storage Technologycross
Intel 64checkmark
Intel Virtualization Technology for Directed I/O (VT-d)checkmark
Intel Clear Video Technologycross
Intel Identity Protection Technology version0.00
Intel Virtualization Technology (VT-x)checkmark
Processor ARK ID64615
Performance
Plug and Playcheckmark
Trusted Platform Module (TPM)checkmark
On-site supportcheckmark
Rack-Friendly boardcheckmark
Trusted Platform Module (TPM) version1.2
EAN5051045112048
Warranty1 year
Source: Icecat.biz
The IBM® Flex System™ x220 Compute Node is the next generation cost-optimized compute node designed for less demanding workloads and low-density virtualization. The x220 is efficient and equipped with flexible configuration options and advanced management to run a broad range of workloads.

Suggested use: For clients looking to deploy an entry virtualization solution as part of a larger data center infrastructure.

IBM Flex System is a new category of computing that integrates multiple server architectures, networking, storage, and system management capability into a single system that is easy to deploy and manage. IBM Flex System has full and built-in virtualization support of servers, storage, and networking to speed provisioning and increased resiliency. In addition, it supports open industry standards, such as operating systems, networking and storage fabrics, virtualization, and system management protocols, to easily fit within existing and future data center environments. IBM Flex System is scalable and extendable with multigenerational upgrades to protect and maximize IT investments.

Scalability and performance

The x220 offers numerous features to boost performance, improve scalability, and reduce costs:

The Intel Xeon processor E5-2400 product family improves productivity by offering affordable dual-socket system performance with eight-core processors with up to 2.3 GHz core speeds, up to 20 MB of L3 cache, and one QPI interconnect link of up to 8 GTps.

Up to two processors, 16 cores total, and 32 threads maximize the concurrent execution of multithreaded applications.

Intelligent and adaptive system performance with Intel Turbo Boost Technology 2.0 allows processor cores to run at maximum speeds during peak workloads by temporarily going beyond processor Thermal Design Power (TDP).

Intel Hyper-Threading Technology boosts performance for multithreaded applications by enabling simultaneous multithreading within each processor core, up to two threads per core.

Intel Virtualization Technology integrates hardware-level virtualization hooks that allow operating system vendors to better use the hardware for virtualization workloads.

Intel Advanced Vector Extensions (AVT) improve floating point performance for compute-intensive technical and scientific applications compared to Intel Xeon 5600 series processors.

There are 12 DIMM sockets supporting low profile (LP) RDIMMs, UDIMMs and LRDIMMs, with a total capacity of up 384 GB using 32 GB LRDIMMs

Supports memory speeds of up to 1600 MHz to maximize memory performance.
Support for 1.8-inch solid-state drives to maximize I/O operations per second (IOPS) and significantly improve application performance.

The theoretical maximum memory bandwidth of the Intel Xeon processor E5-2400 product family is 38.4 GBps, which is 20% more than in the previous generation of Intel Xeon 5600 processors.
The server offers PCI Express 3.0 I/O expansion capabilities that improve the theoretical maximum bandwidth by 60% (8 GTps per link) compared to the previous generation of PCI Express 2.0.

With Intel Integrated I/O Technology, the PCI Express 3.0 controller is integrated into the Intel Xeon processor E5 family. This integration reduces I/O latency and increases overall system performance.
Support for high-bandwidth I/O adapters, up to two in each x220 Compute Node. Support for 10 Gb Ethernet, 16 Gb Fibre Channel, and FDR InfiniBand expansion cards.

Supports the PCIe Expansion Node for support for up to six additional I/O adapters.

Availability and serviceability

The x220 provides many features to simplify serviceability and increase system uptime:
Chipkill, memory mirroring, and memory rank sparing for redundancy in the event of a non-correctable memory failure.

Tool-less cover removal provides easy access to upgrades and serviceable parts, such as processor, memory, and adapter cards.

Hot-swap drives supporting integrated RAID 1 redundancy for data protection and greater system uptime.

A light path diagnostics panel and individual light path LEDs lead the technician to failed (or failing) components. These features simplify servicing, speeds up problem resolution, and helps improve system availability.

Predictive Failure Analysis (PFA) detects when system components (such as processors, memory, and hard disk drives) operate outside of standard thresholds and generates proactive alerts in advance of possible failure, therefore increasing uptime.

Solid-state drives (SSDs), which offer significantly better reliability than traditional mechanical HDDs for greater uptime.

A built-in Integrated Management Module II (IMM2) continuously monitors system parameters, triggers alerts, and performs recovery actions in case of failures to minimize downtime.
Built-in diagnostics using Dynamic Systems Analysis (DSA) Preboot speeds up troubleshooting tasks to reduce service time.

Three-year customer replaceable unit and on-site limited warranty, next business day 9x5. Optional service upgrades are available.

Manageability and security

Powerful systems management features simplify local and remote management of the x220:
The server includes an Integrated Management Module II (IMM2) to monitor server availability and perform remote management.

An integrated industry-standard Unified Extensible Firmware Interface (UEFI) enables improved setup, configuration, and updates, and simplifies error handling.

Integrated Trusted Platform Module (TPM) V 1.2 support enables advanced cryptographic functionality, such as digital signatures and remote attestation.

Industry-standard AES NI support for faster, stronger encryption.

Integrates with the IBM® Flex System™ Manager for proactive systems management. It offers comprehensive systems management for the entire IBM Flex System platform, increasing uptime, reducing costs, and improving productivity through advanced server management capabilities.
IBM Fabric Manager simplifies the deployment of infrastructure connections by managing network and storage address assignments.

Intel Execute Disable Bit functionality can help prevent certain classes of malicious buffer overflow attacks when combined with a supporting operating system.
Intel Trusted Execution Technology provides enhanced security through hardware-based resistance to malicious software attacks, allowing an application to run in its own isolated space protected from all other software running on a system.

Energy efficiency

The x220 offers the following energy-efficiency features to save energy, reduce operational costs, increase energy availability, and contribute to a green environment:
Component-sharing design of the IBM Flex System chassis provides ultimate power and cooling savings.

The Intel Xeon processor E5-2400 product family offers better performance over the previous generation while fitting into the same TDP limits.
Intel Intelligent Power Capability powers individual processor elements on and off as needed, to reduce power draw.

Low-voltage Intel Xeon processors draw less energy to satisfy demands of power and thermally constrained data centers and telecommunication environments.
Low-voltage 1.35 V DDR3 memory RDIMMs consume 15% less energy than 1.5 V DDR3 RDIMMs.
Solid-state drives (SSDs) consume as much as 80% less power than traditional spinning 2.5-inch HDDs.

The server uses hexagonal ventilation holes, a part of IBM Calibrated Vectored Cooling™ technology. Hexagonal holes can be grouped more densely than round holes, providing more efficient airflow through the system.

Active Energy Manager provides advanced power management features with actual real-time energy monitoring, reporting, and capping features.

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The above technical details are for reference only and may change without notice. We reserve the right to correct printing errors and use illustrations for guidance. Some text may be auto-generated or machine-translated, which could lead to inaccuracies.

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