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| Hard drive | |
| HDD interface | SATA |
| Device type | HDD |
| Weight & dimensions | |
| Weight | 650 g |
| Height | 26.1 mm |
| Width | 101.8 mm |
| Depth | 147 mm |
| Energy management | |
| Operating voltage | 5 / 12 V |
| Power consumption (idle) | 4.5 W |
| Operational conditions | |
| Operating relative humidity (H-H) | 5 - 90% |
| Storage temperature (T-T) | -40 - 70 °C |
| Operating temperature (T-T) | 5 - 60 °C |
| Storage relative humidity (H-H) | 5 - 95% |
| Non-operating altitude | -304.8 - 12192 m |
| Operating shock | 70 G |
| Non-operating shock | 250 G |
| Non-operating vibration | 2.27 G |
| Performance | |
| Drive capacity | 10000 GB |
| Features | |
| Drive capacity | 10000 GB |
| Interface | Serial ATA III |
| Type | HDD |
| HDD speed | 7200 RPM |
| Mean time between failures (MTBF) | 2500000 h |
| Average latency | 4.16 ms |
| HDD size | 3.5" |
| Component for | PC |
| HDD interface transfer rate | 6 Gbit/s |
| EAN | 8719706002042 |
| Warranty | 5 years |
- 10TB per drive for 25% more petabytes per rack
- Industry's lowest power and weight for optimum data center TCO
- Forged, wrought-aluminum base and a helium sealed-drive design with uniform
- density and no porosity
- Superior material and weld-width design for a more robust, hermetically sealed-drive
- enclosure that protects from helium leaks
- Digital environmental sensors for measuring internal humidity, pressure and
- temperature, helping to ensure high reliability, performance and quality
- Latest hermetic interconnect technology supporting higher data rate heads and higher
- pin counts for extreme thermal conditions
- Proven enterprise-class reliability backed by 2.5M-hr MTBF
- Industry's lowest power and weight for optimum data center TCO
- Forged, wrought-aluminum base and a helium sealed-drive design with uniform
- density and no porosity
- Superior material and weld-width design for a more robust, hermetically sealed-drive
- enclosure that protects from helium leaks
- Digital environmental sensors for measuring internal humidity, pressure and
- temperature, helping to ensure high reliability, performance and quality
- Latest hermetic interconnect technology supporting higher data rate heads and higher
- pin counts for extreme thermal conditions
- Proven enterprise-class reliability backed by 2.5M-hr MTBF
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The above technical details are for reference only and may change without notice. We reserve the right to correct printing errors and use illustrations for guidance. Some text may be auto-generated or machine-translated, which could lead to inaccuracies.