Thermal Grizzly Minus Pad 8 TG-MP8-120-20-30-1R 120 x 20 x 3 mm Thermal Pad, Pink

The Thermal Grizzly Minus Pad 8 (120 x 20 x 3 mm) is a thermal interface material designed to bridge gaps between electronic components and heatsinks. With a thermal conductivity of 8 W/m·K, it helps move heat away from hardware during operation. The pad is made from a silicone base with nano aluminium oxide for consistent thermal performance. Its low thermal resistance minimises the barrier between the heat source and the cooling solution. The Minus Pad 8 is ideal for hardware where standard thermal paste is impractical due to uneven surfaces.

This pink, 3 mm thick pad is slightly compressible, allowing it to conform to surface irregularities. Its flexibility ensures full contact with chipsets, VRMs, and water-cooling blocks. As the material is non-conductive, it can be used near exposed circuitry without the risk of electrical short circuits. Its non-corrosive properties also prevent damage to metal cooling surfaces or semiconductor packaging. Each pack contains a single 120 x 20 mm strip that can be trimmed to fit specific components. The pad remains stable during application and does not require curing time to reach its rated performance.

• 8 W/m·K thermal conductivity: provides effective heat dissipation for components such as GPUs and VRMs.
• Electrically non-conductive and non-corrosive: protects hardware from electrical shorts and chemical degradation.
• Ceramic-silicone and nano aluminium oxide: maintains structural integrity and performance across various operating temperatures.
• 3 mm thickness: bridges larger gaps that liquid paste cannot effectively reach.
• 120 x 20 mm format: allows for custom trimming to fit specific PCB layouts or multiple small components.