Key Specifications
Choose one or multiple features to search for items that have the same specifications.| Memory | |
| Internal memory | 8 GB |
| Intel Extreme Memory Profile (XMP) | ![]() |
| Weight & dimensions | |
| Length | 30 mm |
| Features | |
| Internal memory type | DDR5 |
| ECC | ![]() |
| Module configuration | 1024M x 16 |
| CAS latency | 40 |
| Memory clock speed | 4800 MHz |
| Memory voltage | 1.1 V |
| RoHS compliance | ![]() |
| Memory form factor | 262-pin SO-DIMM |
| Component for | Laptop |
| Internal memory | 8 GB |
| Memory layout (modules x size) | 1 x 8 GB |
| Memory data transfer rate | 4800 MT/s |
| Buffered memory type | Unregistered (unbuffered) |
| EAN | 5059902031181 |
The Samsung M425R1GB4BB0-CQK is an 8 GB DDR5 memory module engineered for laptops and other compact systems that utilize the SO-DIMM form factor. Operating at a data transfer rate of 4800 MT/s, this module provides the performance necessary for general computing and multitasking applications. As a single 8 GB stick, it can function as a direct replacement or an incremental upgrade for compatible devices. It is manufactured according to JEDEC industry standards, which promotes broad compatibility with systems that accept 262-pin DDR5 SO-DIMM modules.
This module functions at a standard 1.1 V, which contributes to the power efficiency required in portable computing environments. It features a CAS latency of 40, consistent with its operational speed. A core feature of the DDR5 specification is On-Die Error Correction Code (ECC), which is integrated to correct single-bit errors within the DRAM chip itself. This mechanism enhances data integrity and contributes to overall system stability during operation. The design does not include a heat spreader, which is typical for SO-DIMM modules intended for internal installation.
Key Features:- Memory Capacity: 8 GB
- Memory Type: DDR5
- Module Configuration: 1 x 8 GB
- Form Factor: 262-pin SO-DIMM
- Speed: 4800 MHz
- CAS Latency: CL40
- Operating Voltage: 1.1 V
- Error Correction: Integrated On-Die ECC
- Memory Profile: Unbuffered non-ECC
- Compliance: Built to JEDEC standards
Estimated delivery: 15.12
Today: Closed (Independence Day)
Estimated delivery: 15.12
Today: Closed
Estimated delivery: 15.12
Today: Closed
Estimated delivery: 15.12
Today: Closed
Estimated delivery: 15.12
Today: Closed (Independence Day)
Estimated delivery time: 15.12
Estimated delivery time: 16.12
Estimated delivery time: 15.12
Estimated delivery time: 16.12
Estimated delivery time: 16.12
Estimated delivery time: 15.12
Estimated delivery time: 15.12
Estimated delivery time: 16.12


